Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more information74ABTH162245ADL
参数类型
型号 | Package name |
---|---|
74ABTH162245ADL | SSOP48 |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74ABTH162245ADL | 74ABTH162245ADL,11 (935228910112) |
Obsolete | ABTH162245A Standard Procedure Standard Procedure |
SSOP48 (SOT370-1) |
SOT370-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
74ABTH162245ADL:11 (935228910118) |
Obsolete | ABTH162245A Standard Procedure Standard Procedure | SOT370-1_118 |
环境信息
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74ABTH162245ADL | 74ABTH162245ADL,11 | 74ABTH162245ADL | ||
74ABTH162245ADL | 74ABTH162245ADL:11 | 74ABTH162245ADL |
Series
文档 (5)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
abt | abt Spice model | SPICE model | 2013-05-07 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.