外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT370-1 | SSOP48 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | MO-118 (JEDEC) | 2003-02-19 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SOT370-1_118 | SSOP48; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|