74HC74-Q100; 74HCT74-Q100
Dual D-type flip-flop with set and reset; positive edge-trigger
The 74HC74-Q100; 74HCT74-Q100 are dual positive edge triggered D-type flip-flop with individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition, will be stored in the flip-flop and appear at the nQ output. The Schmitt-trigger action in the clock input, makes the circuit highly tolerant to slower clock rise and fall times. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Input levels:
For 74HC74-Q100: CMOS level
For 74HCT74-Q100: TTL level
Symmetrical output impedance
Low power dissipation
High noise immunity
Balanced propagation delays
Specified in compliance with JEDEC standard no. 7A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74HC74BQ-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | DHVQFN14 |
74HC74D-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | SO14 |
74HC74PW-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | TSSOP14 |
74HCT74BQ-Q100 | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | DHVQFN14 |
74HCT74D-Q100 | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | SO14 |
74HCT74PW-Q100 | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | TSSOP14 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74HC74BQ-Q100 | 74HC74BQ-Q100,115 (935298879115) |
Active | HC74 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74HC74D-Q100 | 74HC74D-Q100,118 (935298881118) |
Active | 74HC74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74HC74PW-Q100 | 74HC74PW-Q100,118 (935298882118) |
Active | HC74 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
74HCT74BQ-Q100 | 74HCT74BQ-Q100,115 (935298883115) |
Active | HCT74 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74HCT74D-Q100 | 74HCT74D-Q100,118 (935298884118) |
Active | 74HCT74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74HCT74PW-Q100 | 74HCT74PW-Q100,118 (935298885118) |
Active | HCT74 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74HC74BQ-Q100 | 74HC74BQ-Q100,115 | 74HC74BQ-Q100 | ||
74HC74D-Q100 | 74HC74D-Q100,118 | 74HC74D-Q100 | ||
74HC74PW-Q100 | 74HC74PW-Q100,118 | 74HC74PW-Q100 | ||
74HCT74BQ-Q100 | 74HCT74BQ-Q100,115 | 74HCT74BQ-Q100 | ||
74HCT74D-Q100 | 74HCT74D-Q100,118 | 74HCT74D-Q100 | ||
74HCT74PW-Q100 | 74HCT74PW-Q100,118 | 74HCT74PW-Q100 |
文档 (20)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT74_Q100 | Dual D-type flip-flop with set and reset; positive edge-trigger | Data sheet | 2024-04-02 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
hc74 | 74HC74 IBIS model | IBIS model | 2022-10-21 |
hct74 | 74HCT74 IBIS model | IBIS model | 2022-10-21 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
hc74 | 74HC74 IBIS model | IBIS model | 2022-10-21 |
hct74 | 74HCT74 IBIS model | IBIS model | 2022-10-21 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
Ordering, pricing & availability
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