外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT340-1 | SSOP24 | plastic, shrink small outline package; 24 leads; 0.65 mm pitch; 8.2 mm x 5.3 mm x 2 mm body | MO-150 (JEDEC) | 2003-02-19 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT340-1 | plastic, shrink small outline package; 24 leads; 0.65 mm pitch; 8.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT340-1_118 | SSOP24; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|