参数类型
型号 |
---|
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AXP1T57DC | 74AXP1T57DCH (935305664125) |
Obsolete | no package information | ||||
74AXP1T57GN | 74AXP1T57GNX (935305666115) |
Obsolete | no package information | ||||
74AXP1T57GS | 74AXP1T57GSX (935305667115) |
Withdrawn / End-of-life | rD |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
74AXP1T57GT | 74AXP1T57GTX (935305668115) |
Obsolete | no package information | ||||
74AXP1T57GX | 74AXP1T57GXX (935308434115) |
Withdrawn / End-of-life | rD |
X2SON8 (SOT1233-2) |
SOT1233-2 | SOT1233-2_115 |
环境信息
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AXP1T57DC | 74AXP1T57DCH | 74AXP1T57DC | ||
74AXP1T57GN | 74AXP1T57GNX | 74AXP1T57GN | ||
74AXP1T57GS | 74AXP1T57GSX | 74AXP1T57GS | ||
74AXP1T57GT | 74AXP1T57GTX | 74AXP1T57GT | ||
74AXP1T57GX | 74AXP1T57GXX | 74AXP1T57GX |
文档 (16)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AXP1T57 | Dual supply configurable multiple function gate | Data sheet | 2022-06-17 |
AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT1233-2 | 3D model for products with SOT1233-2 package | Design support | 2021-01-28 |
axp1t57 | 74AXP1T57 IBIS model | IBIS model | 2016-03-01 |
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
SOT1233-2 | plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm | Package information | 2022-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
Ordering, pricing & availability
样品
作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。