封装
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74HC160D | 74HC160D,652 (933714510652) |
Obsolete | no package information | ||||
| 74HC160D,653 (933714510653) |
Obsolete | ||||||
| 74HC160DB | 74HC160DB,112 (935189680112) |
Obsolete | HC160 Standard Procedure Standard Procedure |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
| 74HC160DB,118 (935189680118) |
Obsolete | HC160 Standard Procedure Standard Procedure | 暂无信息 | ||||
环境信息
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC160D | 74HC160D,652 | 74HC160D |
|
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| 74HC160D | 74HC160D,653 | 74HC160D |
|
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| 74HC160DB | 74HC160DB,112 | 74HC160DB |
|
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| 74HC160DB | 74HC160DB,118 | 74HC160DB |
|
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文档 (7)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74HC160 | Presettable synchronous BCD decade counter; asynchronous reset | Data sheet | 2019-03-29 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
No documents available