参数类型
| 型号 |
|---|
封装
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AXP2G14GM | 74AXP2G14GMH (935304096125) |
Withdrawn / End-of-life | rK |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
| 74AXP2G14GN | 74AXP2G14GNH (935304097125) |
Withdrawn / End-of-life | rK |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
暂无信息 |
| 74AXP2G14GS | 74AXP2G14GSH (935304098125) |
Obsolete | no package information | ||||
| 74AXP2G14GX | 74AXP2G14GXH (935307133125) |
Obsolete | rK |
X2SON6 (SOT1255-2) |
SOT1255-2 | 暂无信息 | |
| 74AXP2G14GXZ (935307133147) |
Withdrawn / End-of-life | rK | SOT1255-2_147 | ||||
环境信息
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AXP2G14GM | 74AXP2G14GMH | 74AXP2G14GM |
|
|
| 74AXP2G14GN | 74AXP2G14GNH | 74AXP2G14GN |
|
|
| 74AXP2G14GS | 74AXP2G14GSH | 74AXP2G14GS |
|
|
| 74AXP2G14GX | 74AXP2G14GXH | 74AXP2G14GX |
|
|
| 74AXP2G14GX | 74AXP2G14GXZ | 74AXP2G14GX |
|
|
文档 (18)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AXP2G14 | Low-power dual Schmitt trigger inverter | Data sheet | 2022-02-22 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
Ordering, pricing & availability
样品
作为 Nexperia 的客户，您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。