参数类型
型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|---|
74VHC245BQ | n.a. | n.a. | CMOS | ± 8 | 3.5 | 8 | 60 | low | -40~125 | DHVQFN20 |
74VHC245D | n.a. | n.a. | CMOS | ± 8 | 3.5 | 8 | 60 | low | -40~125 | SO20 |
74VHC245PW | n.a. | n.a. | CMOS | ± 8 | 3.5 | 8 | 60 | low | -40~125 | TSSOP20 |
74VHCT245BQ | n.a. | n.a. | TTL | ± 8 | 5.0 | 8 | 60 | low | -40~125 | DHVQFN20 |
74VHCT245D | n.a. | n.a. | TTL | ± 8 | 5.0 | 8 | 60 | low | -40~125 | SO20 |
74VHCT245PW | n.a. | n.a. | TTL | ± 8 | 5.0 | 8 | 60 | low | -40~125 | TSSOP20 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74VHC245BQ | 74VHC245BQ,115 (935289581115) |
Active | VHC245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
74VHC245D | 74VHC245D,118 (935289582118) |
Active | 74VHC245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
74VHC245PW | 74VHC245PW,118 (935289583118) |
Active | VHC245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
74VHCT245BQ | 74VHCT245BQ,115 (935289584115) |
Active | VHCT245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
74VHCT245D | 74VHCT245D,118 (935289585118) |
Active | 74VHCT245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
74VHCT245PW | 74VHCT245PW,118 (935289586118) |
Active | VHCT245 VHCT245 Standard Procedure Standard Procedure |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74VHC245BQ | 74VHC245BQ,115 | 74VHC245BQ | ||
74VHC245D | 74VHC245D,118 | 74VHC245D | ||
74VHC245PW | 74VHC245PW,118 | 74VHC245PW | ||
74VHCT245BQ | 74VHCT245BQ,115 | 74VHCT245BQ | ||
74VHCT245D | 74VHCT245D,118 | 74VHCT245D | ||
74VHCT245PW | 74VHCT245PW,118 | 74VHCT245PW |
文档 (14)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74VHC_VHCT245 | Octal bus transceiver; 3-state | Data sheet | 2024-07-08 |
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
74vhc245 | 74vhc245 IBIS model | IBIS model | 2013-04-08 |
74vhct245 | 74vhct245 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
74vhc245 | 74vhc245 IBIS model | IBIS model | 2013-04-08 |
74vhct245 | 74vhct245 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
样品
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