NG体育娱乐，ng体育平台

双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 PXN2R9-100RS

作为一家积极进取的可持续发展公司，安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息，恩智浦可以向我们的客户提供相关资料，以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据，这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934666162118PXN2R9-100RSJPXN2R9-100RSSOT8038 (MLPAK56)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 35922 ppm of the article. SCIP No. 24e93d05-16ea-4d4d-9b74-bf828c49af95.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 35922 ppm; substance 1333-86-4: 1755 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 35922 ppm; substance 1333-86-4: 1755 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 1374 ppm; substance 7440-57-5: 304 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-33.295785100.0000002.963047
Die Total3.295785100.0000002.963047
ClipCopper alloyCopper (Cu)7440-50-815.11250097.50000013.586764
ClipCopper alloyIron (Fe)7439-89-60.3565002.3000000.320508
ClipCopper alloyZinc (Zn)7440-66-60.0155000.1000000.013935
ClipCopper alloyPhosphorus (P)7723-14-00.0124000.0800000.011148
ClipImpurityLead (Pb)7439-92-10.0031000.0200000.002787
Clip Total15.500000100.00000013.935142
Lead FrameCopper alloyCopper (Cu)7440-50-846.28690697.65170041.613846
Lead FrameCopper alloyIron (Fe)7439-89-61.0191002.1500000.916213
Lead FrameCopper alloyZinc (Zn)7440-66-60.0331800.0700000.029830
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0118500.0250000.010654
Lead FrameImpurityLead (Pb)7439-92-10.0006160.0013000.000554
Lead FramePure metal layerSilver (Ag)7440-22-40.0483480.1020000.043467
Lead Frame Total47.400000100.00000042.614564
Mould CompoundFillerSilica fused60676-86-027.33500070.00000024.575297
Mould CompoundFillerSilica -amorphous-7631-86-95.85750015.0000005.266135
Mould CompoundHardenerPhenolic resin2.7335007.0000002.457530
Mould CompoundPolymerEpoxy resin system2.7335007.0000002.457530
Mould CompoundAdditiveNon hazardous0.1952500.5000000.175538
Mould CompoundPigmentCarbon black1333-86-40.1952500.5000000.175538
Mould Compound Total39.050000100.00000035.107568
Post-PlatingTin solderTin (Sn)7440-31-51.76982399.9900001.591144
Post-PlatingImpurityNon hazardous0.0001770.0100000.000159
Post-Plating Total1.770000100.0000001.591303
WirePure metalGold (Au)7440-57-50.03379199.9900000.030380
WireImpurityNon hazardous0.0000040.0100000.000003
Wire Total0.033795100.0000000.030383
Solder PasteLead alloyLead (Pb)7439-92-13.99190095.5000003.588883
Solder PasteLead alloySilver (Ag)7440-22-40.1045002.5000000.093950
Solder PasteLead alloyTin (Sn)7440-31-50.0836002.0000000.075160
Solder Paste Total4.180000100.0000003.757993
PXN2R9-100RS Total111.229580100.000000100.000000


NG体育娱乐，ng体育平台

Notes
Report created on 2024-11-10 12:55:09 CET+0100


NG体育娱乐，ng体育平台

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locationss. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3


NG体育娱乐，ng体育平台

Notes
Report created on 2024-11-10 12:55:09 CET+0100


NG体育娱乐，ng体育平台

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locationss. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material		 有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
半导体芯片 (Die)◯◯◯◯◯◯
夹子 (Clip)◯◯◯◯◯◯
引线框架 (Lead Frame)◯◯◯◯◯◯
模封料 (Mould Compound)◯◯◯◯◯◯
后镀层 (Post-Plating)◯◯◯◯◯◯
导线 (Wire)◯◯◯◯◯◯
锡膏 (Solder Paste)✕◯◯◯◯◯
◯ 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕ 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限（EFUP）。
This semiconductor product has an indefinite environmental friendly use period (EFUP).


NG体育娱乐，ng体育平台

Notes
Report created on 2024-11-10 12:55:09 CET+0100


NG体育娱乐，ng体育平台

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locationss. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.