| 12NC | OPN | Type No. | Package | State | MSL |
|---|---|---|---|---|---|
| 935301599125 | 74AXP1G58GMH | 74AXP1G58GM | SOT886 (XSON6) | DOD | 1 |
| REACH | Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article. |
| EU RoHS | Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions. |
| CN RoHS | Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS). |
| ELV | Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions. |
| PFAS | Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS). |
| CA Proposition 65 | Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 18480 ppm; substance 1333-86-4: 1056 ppm; |
| IEC 62474 | Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 18480 ppm; substance 1333-86-4: 1056 ppm; |
| Precious Metals | Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 502 ppm; substance 7440-57-5: 13843 ppm; |
| RHF Indicator | Lead-free and halogen-free according to Nexperia's halogen-free definition.   |
| Material | Material Group | Substance | CAS No. | Mass (mg) | Material (%) | Product (%) |
|---|---|---|---|---|---|---|
| Adhesive | Filler | Silica -amorphous- | 7631-86-9 | 0.002500 | 50.000000 | 0.130385 |
| Adhesive | Polymer | Epoxy resin system | 0.001500 | 30.000000 | 0.078231 | |
| Adhesive | Polymer | Phenol Formaldehyde resin (generic) | 9003-35-4 | 0.000500 | 10.000000 | 0.026077 |
| Adhesive | Filler | Bisphenol A-epichlorohydrin resin | 25068-38-6 | 0.000250 | 5.000000 | 0.013038 |
| Adhesive | Additive | Non hazardous | 0.000250 | 5.000000 | 0.013038 | |
| Adhesive Total | 0.005000 | 100.000000 | 0.260769 | |||
| Die | Doped Silicon | Silicon (Si) | 7440-21-3 | 0.047749 | 100.000000 | 2.490294 |
| Die Total | 0.047749 | 100.000000 | 2.490294 | |||
| Lead Frame | Copper alloy | Copper (Cu) | 7440-50-8 | 0.729617 | 94.510000 | 38.052350 |
| Lead Frame | Copper alloy | Nickel (Ni) | 7440-02-0 | 0.022774 | 2.950000 | 1.187751 |
| Lead Frame | Copper alloy | Silicon (Si) | 7440-21-3 | 0.004941 | 0.640000 | 0.257681 |
| Lead Frame | Copper alloy | Magnesium (Mg) | 7439-95-4 | 0.001158 | 0.150000 | 0.060393 |
| Lead Frame | Pure metal layer | Nickel (Ni) | 7440-02-0 | 0.012661 | 1.640000 | 0.660309 |
| Lead Frame | Pure metal layer | Palladium (Pd) | 7440-05-3 | 0.000695 | 0.090000 | 0.036236 |
| Lead Frame | Pure metal layer | Gold (Au) | 7440-57-5 | 0.000154 | 0.020000 | 0.008052 |
| Lead Frame Total | 0.772000 | 100.000000 | 40.262772 | |||
| Mould Compound | Filler | Silica fused | 60676-86-0 | 0.918359 | 86.150000 | 47.895963 |
| Mould Compound | Polymer | Epoxy resin system | 0.092422 | 8.670000 | 4.820173 | |
| Mould Compound | Hardener | Phenolic resin | 0.045731 | 4.290000 | 2.385068 | |
| Mould Compound | Additive | Non hazardous | 0.004372 | 0.410000 | 0.227942 | |
| Mould Compound | Filler | Silica -amorphous- | 7631-86-9 | 0.003091 | 0.290000 | 0.161227 |
| Mould Compound | Pigment | Carbon black | 1333-86-4 | 0.002025 | 0.190000 | 0.105631 |
| Mould Compound Total | 1.066000 | 100.000000 | 55.596004 | |||
| Wire | Gold alloy | Gold (Au) | 7440-57-5 | 0.026388 | 99.000000 | 1.376259 |
| Wire | Gold alloy | Palladium (Pd) | 7440-05-3 | 0.000267 | 1.000000 | 0.013902 |
| Wire Total | 0.026655 | 100.000000 | 1.390161 | |||
| 74AXP1G58GM Total | 1.917404 | 100.000000 | 100.000000 |
NG体育娱乐，ng体育平台
| Notes |
|---|
| Report created on 2024-11-10 12:01:58 CET+0100 |
NG体育娱乐，ng体育平台
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locationss. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |
| Pb-free Soldering | Pb Soldering | No. of Processing Cycles | ||
|---|---|---|---|---|
| PPT | MPPT | PPT | MPPT | |
| 260 °C | 40 s | 235 °C | 30 s | 3 |
NG体育娱乐，ng体育平台
| Notes |
|---|
| Report created on 2024-11-10 12:01:58 CET+0100 |
NG体育娱乐，ng体育平台
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locationss. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |