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双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 74AUP2G132GF

作为一家积极进取的可持续发展公司，安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息，恩智浦可以向我们的客户提供相关资料，以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据，这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
93529147711574AUP2G132GF,11574AUP2G132GFSOT1089 (XSON8)DOD1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 14611 ppm; substance 1333-86-4: 2621 ppm; substance 7439-92-1: 1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 14611 ppm; substance 1333-86-4: 2621 ppm; substance 7439-92-1: 1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 437 ppm; substance 7440-57-5: 17493 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerAluminium Trioxide (Al2O3)1344-28-10.00800040.0000000.446204
AdhesivePolymerResin system0.00600030.0000000.334653
AdhesivePolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.00300015.0000000.167327
AdhesivePolymerBisphenol A-epichlorohydrin resin25068-38-60.00200010.0000000.111551
AdhesiveAdditiveNon hazardous0.0010005.0000000.055776
Adhesive Total0.020000100.0000001.115511
DieDoped siliconSilicon (Si)7440-21-30.101355100.0000005.653132
Die Total0.101355100.0000005.653132
Lead FrameCopper alloyCopper (Cu)7440-50-80.63723795.11000035.542250
Lead FrameCopper alloyNickel (Ni)7440-02-00.0212393.1700001.184617
Lead FrameCopper alloySilicon (Si)7440-21-30.0046230.6900000.257850
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0013400.2000000.074739
Lead FramePure metal layerNickel (Ni)7440-02-00.0049580.7400000.276535
Lead FramePure metal layerPalladium (Pd)7440-05-30.0004690.0700000.026159
Lead FramePure metal layerGold (Au)7440-57-50.0001340.0200000.007475
Lead Frame Total0.670000100.00000037.369625
Mould CompoundFillerSilica fused60676-86-00.56400060.00000031.457414
Mould CompoundFillerSilica -amorphous-7631-86-90.21620023.00000012.058676
Mould CompoundPolymerEpoxy resin system0.0658007.0000003.670032
Mould CompoundPolymerPhenolic resin0.0564006.0000003.145742
Mould CompoundFlame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0282003.0000001.572871
Mould CompoundPigmentCarbon black1333-86-40.0047000.5000000.262145
Mould CompoundIon trapping agentBismuth (Bi)7440-69-90.0047000.5000000.262145
Mould Compound Total0.940000100.00000052.429025
Post-PlatingTin solderTin (Sn)7440-31-50.02999799.9900001.673099
Post-PlatingImpurityLead (Pb)7439-92-10.0000020.0050000.000084
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000010.0030000.000050
Post-PlatingImpurityCopper (Cu)7440-50-80.0000000.0010000.000017
Post-PlatingImpurityBismuth (Bi)7440-69-90.0000000.0010000.000017
Post-Plating Total0.030000100.0000001.673267
WireGold alloyGold (Au)7440-57-50.03123099.0000001.741846
WireGold alloyPalladium (Pd)7440-05-30.0003151.0000000.017594
Wire Total0.031545100.0000001.759440
74AUP2G132GF Total1.792900100.000000100.000000

NG体育娱乐，ng体育平台

Notes
Report created on 2024-11-10 12:01:08 CET+0100

NG体育娱乐，ng体育平台

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locationss. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3

NG体育娱乐，ng体育平台

Notes
Report created on 2024-11-10 12:01:08 CET+0100

NG体育娱乐，ng体育平台

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locationss. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material		 有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)◯◯◯◯◯◯
半导体芯片 (Die)◯◯◯◯◯◯
引线框架 (Lead Frame)◯◯◯◯◯◯
模封料 (Mould Compound)◯◯◯◯◯◯
后镀层 (Post-Plating)◯◯◯◯◯◯
导线 (Wire)◯◯◯◯◯◯
◯ 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕ 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限（EFUP）。
This semiconductor product has an indefinite environmental friendly use period (EFUP).

NG体育娱乐，ng体育平台

Notes
Report created on 2024-11-10 12:01:08 CET+0100

NG体育娱乐，ng体育平台

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locationss. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.