NG体育娱乐，ng体育平台

×

74AUP2G00

Low-power dual 2-input NAND gate

The 74AUP2G00 provides dual 2-input NAND function.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD78 Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP2G00DCProduction0.8 - 3.6CMOS± 1.98.3702ultra low-40~12520334.1113VSSOP8
74AUP2G00GNProduction0.8 - 3.6CMOS± 1.98.3702ultra low-40~12523810.6148XSON8
74AUP2G00GSProduction0.8 - 3.6CMOS± 1.98.3702ultra low-40~12527610.8146XSON8
74AUP2G00GTProduction0.8 - 3.6CMOS± 1.98.3702ultra low-40~1253276.1157XSON8
74AUP2G00GXProduction0.8 - 3.6CMOS± 1.98.3702ultra low-40~125---X2SON8

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP2G00DC
VSSOP8
(SOT765-1) 		SOT765-1SOT765-1_125Activep0074AUP2G00DC,125
( 9352 807 06125 )
74AUP2G00GN
XSON8
(SOT1116) 		SOT1116REFLOW_BG-BD-1
SOT1116_115ActivepA74AUP2G00GN,115
( 9352 922 17115 )
74AUP2G00GS
XSON8
(SOT1203) 		SOT1203REFLOW_BG-BD-1
SOT1203_115ActivepA74AUP2G00GS,115
( 9352 927 78115 )
74AUP2G00GT
XSON8
(SOT833-1) 		SOT833-1SOT833-1_115Activep0074AUP2G00GT,115
( 9352 807 07115 )
74AUP2G00GX
X2SON8
(SOT1233-2) 		SOT1233-2SOT1233-2_115ActivepA74AUP2G00GXX
( 9353 084 39115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP2G00DC74AUP2G00DC,12574AUP2G00DCAlways Pb-free
74AUP2G00GN74AUP2G00GN,11574AUP2G00GNAlways Pb-free
74AUP2G00GS74AUP2G00GS,11574AUP2G00GSAlways Pb-free
74AUP2G00GT74AUP2G00GT,11574AUP2G00GTAlways Pb-free
74AUP2G00GX74AUP2G00GXX74AUP2G00GXweek 25, 2019
品质及可靠性免责声明

文档 (17)

文件名称标题类型日期
74AUP2G00Low-power dual 2-input NAND gateData sheet2024-05-29
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup2g00aup2g00 IBIS modelIBIS model2013-04-07
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
SOT1233-2plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mmPackage information2022-04-21
MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

模型

文件名称标题类型日期
aup2g00aup2g00 IBIS modelIBIS model2013-04-07

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品

NG体育娱乐，ng体育平台