特性
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Wide supply voltage range from 0.8 V to 3.6 V
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High noise immunity
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Complies with JEDEC standards:
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JESD8-12 (0.8 V to 1.3 V)
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JESD8-11 (0.9 V to 1.65 V)
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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Low static power consumption; ICC = 0.9 μA (maximum)
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Latch-up performance exceeds 100 mA per JESD 78 Class II
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Overvoltage tolerant inputs to 3.6 V
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AUP1G3208GF NRND | Not for design in | - | - | - | - | - | - | - | - | - | - | - | XSON6 |
74AUP1G3208GM | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | 290 | 6.5 | 145 | XSON6 |
74AUP1G3208GN | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | 275 | 11.7 | 171 | XSON6 |
74AUP1G3208GS | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | 272 | 14.8 | 177 | XSON6 |
74AUP1G3208GW | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 |
74AUP1G3208GX | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | - | - | - | X2SON6 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74AUP1G3208GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | a2 | 74AUP1G3208GM,132 ( 9352 806 17132 ) |
SOT886_115 | Active | a2 | 74AUP1G3208GM,115 ( 9352 806 17115 ) | ||||
74AUP1G3208GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | a2 | 74AUP1G3208GN,132 ( 9352 917 34132 ) |
74AUP1G3208GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | a2 | 74AUP1G3208GS,132 ( 9352 928 58132 ) |
74AUP1G3208GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | a2 | 74AUP1G3208GW,125 ( 9352 806 16125 ) | |
74AUP1G3208GX | X2SON6 (SOT1255-2) | SOT1255-2 | SOT1255-2_147 | Active | a2 | 74AUP1G3208GXZ ( 9353 084 66147 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
74AUP1G3208GF | 935281323132 | 2021-06-30 | 2021-12-31 | 74AUP1G3208GS |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74AUP1G3208GM | 74AUP1G3208GM,132 | 74AUP1G3208GM | Always Pb-free | ||
74AUP1G3208GM | 74AUP1G3208GM,115 | 74AUP1G3208GM | Always Pb-free | ||
74AUP1G3208GN | 74AUP1G3208GN,132 | 74AUP1G3208GN | Always Pb-free | ||
74AUP1G3208GS | 74AUP1G3208GS,132 | 74AUP1G3208GS | Always Pb-free | ||
74AUP1G3208GW | 74AUP1G3208GW,125 | 74AUP1G3208GW | Always Pb-free | ||
74AUP1G3208GX | 74AUP1G3208GXZ | 74AUP1G3208GX | week 25, 2019 |
文档 (22)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AUP1G3208 | Low-power 3-input OR-AND gate | Data sheet | 2023-07-18 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
aup1g3208 | 74AUP1G3208 IBIS model | IBIS model | 2016-02-24 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_document_Logic_CombinationLogic_infocard_201710 | Combination logic solutions card | Leaflet | 2017-10-16 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
aup1g3208 | 74AUP1G3208 IBIS model | IBIS model | 2016-02-24 |
样品
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