特性
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Wide supply voltage range from 1.65 V to 5.5 V
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Overvoltage tolerant inputs to 5.5 V
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High noise immunity
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CMOS low power dissipation
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IOFF circuitry provides partial Power-down mode operation
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±24 mA output drive (VCC = 3.0 V)
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Latch-up performance exceeds 250 mA
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Direct interface with TTL levels
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Complies with JEDEC standard:
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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- Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LVC1G240GM | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 313 | 158 | XSON6 |
74LVC1G240GS | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 325 | 218 | XSON6 |
74LVC1G240GW | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 313 | 158 | TSSOP5 |
74LVC1G240GX | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 327 | 195 | X2SON5 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LVC1G240GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_115 | Active | V2 | 74LVC1G240GM,115 ( 9352 772 05115 ) |
74LVC1G240GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_125 | Active | V2 | 74LVC1G240GSH ( 9356 912 54125 ) |
74LVC1G240GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | V2 | 74LVC1G240GWH ( 9356 915 62125 ) |
74LVC1G240GX | X2SON5 (SOT1226-3) | SOT1226-3 | SOT1226-3_125 | Active | V2 | 74LVC1G240GXH ( 9356 912 55125 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
74LVC1G240GM | 935277205132 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74LVC1G240GM | 74LVC1G240GM,115 | 74LVC1G240GM | Always Pb-free | ||
74LVC1G240GS | 74LVC1G240GSH | 74LVC1G240GS | |||
74LVC1G240GW | 74LVC1G240GWH | 74LVC1G240GW | |||
74LVC1G240GX | 74LVC1G240GXH | 74LVC1G240GX |
文档 (11)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC1G240 | Single inverting buffer/line driver; 3-state | Data sheet | 2023-11-01 |
lvc1g240 | 74LVC1G240 IBIS model | IBIS model | 2021-07-29 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
样品
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