• NG体育娱乐，ng体育平台

    ×

    74LVC3G34

    Triple buffer

    The 74LVC3G34 is a triple buffer. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

    Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

    This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 1.65 V to 5.5 V

    • Overvoltage tolerant inputs to 5.5 V

    • High noise immunity

    • ±24 mA output drive (VCC = 3.0 V)

    • CMOS low power consumption

    • Latch-up performance exceeds 250 mA

    • Direct interface with TTL levels

    • Complies with JEDEC standard:

      • JESD8-7 (1.65 V to 1.95 V)

      • JESD8-5 (2.3 V to 2.7 V)

      • JESD8C (2.7 V to 3.6 V)

      • JESD36 (4.5 V to 5.5 V)

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
    74LVC3G34DCProduction1.65 - 5.5CMOS/LVTTL± 321753low-40~125205115VSSOP8
    74LVC3G34DPProduction1.65 - 5.5CMOS/LVTTL± 321753low-40~125217106TSSOP8
    74LVC3G34GNProduction1.65 - 5.5CMOS/LVTTL± 321753low-40~125243152XSON8
    74LVC3G34GSProduction1.65 - 5.5CMOS/LVTTL± 321753low-40~125281149XSON8
    74LVC3G34GTProduction1.65 - 5.5CMOS/LVTTL± 321753low-40~125334162XSON8

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74LVC3G34DC
    VSSOP8
    (SOT765-1)     		SOT765-1SOT765-1_125ActiveY3474LVC3G34DC,125
    ( 9352 755 65125 )
    74LVC3G34DP
    TSSOP8
    (SOT505-2)     		SOT505-2SOT505-2_125ActiveV3474LVC3G34DP,125
    ( 9352 755 66125 )
    74LVC3G34GN
    XSON8
    (SOT1116)     		SOT1116REFLOW_BG-BD-1
    		SOT1116_115ActiveYA74LVC3G34GN,115
    ( 9352 922 57115 )
    74LVC3G34GS
    XSON8
    (SOT1203)     		SOT1203REFLOW_BG-BD-1
    		SOT1203_115ActiveYA74LVC3G34GS,115
    ( 9352 928 14115 )
    74LVC3G34GT
    XSON8
    (SOT833-1)     		SOT833-1SOT833-1_115ActiveY3474LVC3G34GT,115
    ( 9352 789 36115 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74LVC3G34DC74LVC3G34DC,12574LVC3G34DCweek 1, 2005
    74LVC3G34DP74LVC3G34DP,12574LVC3G34DPweek 41, 2004
    74LVC3G34GN74LVC3G34GN,11574LVC3G34GNAlways Pb-free
    74LVC3G34GS74LVC3G34GS,11574LVC3G34GSAlways Pb-free
    74LVC3G34GT74LVC3G34GT,11574LVC3G34GTAlways Pb-free
    品质及可靠性免责声明

    文档 (15)

    文件名称标题类型日期
    74LVC3G34Triple bufferData sheet2023-08-24
    AN10161PicoGate Logic footprintsApplication note2002-10-29
    AN11009Pin FMEA for LVC familyApplication note2019-01-09
    lvc3g3474LVC3G34 IBIS modelIBIS model2015-01-15
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    SOT505-2plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm bodyPackage information2022-06-03
    MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
    SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
    SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
    SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
    MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
    SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    lvc3g3474LVC3G34 IBIS modelIBIS model2015-01-15

    样品

    安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

    样品订单通常需要2-4天寄送时间。

    如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品

    NG体育娱乐，ng体育平台