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    74HC273-Q100; 74HCT273-Q100

    Octal D-type flip-flop with reset; positive-edge trigger

    The 74HC273-Q100; 74HCT273-Q100 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

    This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

    特性

    • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

      • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

    • Wide supply voltage range from 2.0 V to 6.0 V

    • CMOS low power dissipation

    • High noise immunity

    • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

    • Complies with JEDEC standards:

      • JESD8C (2.7 V to 3.6 V)
      • JESD7A (2.0 V to 6.0 V)

    • Input levels:

      • For 74HC273-Q100: CMOS level

      • For 74HCT273-Q100: TTL level

    • Common clock and master reset

    • Eight positive edge-triggered D-type flip-flops

    • ESD protection:

      • HBM JESD22-A114F exceeds 2000 V

      • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)

    • Multiple package options

    • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74HC273BQ-Q100Production2.0 - 6.0CMOS± 5.215122low-40~125789.450DHVQFN20
    74HC273D-Q100Production2.0 - 6.0CMOS± 5.215122low-40~1258527.561SO20
    74HC273PW-Q100Production2.0 - 6.0CMOS± 5.215122low-40~1251004.644.9TSSOP20
    74HCT273BQ-Q100Production4.5 - 5.5TTL± 41536low-40~125789.450DHVQFN20
    74HCT273D-Q100Production4.5 - 5.5TTL± 41536low-40~1258527.561SO20
    74HCT273PW-Q100Production4.5 - 5.5TTL± 41536low-40~1251004.644.9TSSOP20

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74HC273BQ-Q100
    DHVQFN20
    (SOT764-1)     		SOT764-1SOT764-1_115ActiveHC273BQ74HC273BQ-Q100X
    ( 9353 014 57115 )
    74HC273D-Q100
    SO20
    (SOT163-1)     		SOT163-1WAVE_BG-BD-1
    		SOT163-1_118Active74HC273D74HC273D-Q100J
    ( 9353 014 55118 )
    74HC273PW-Q100
    TSSOP20
    (SOT360-1)     		SOT360-1SSOP-TSSOP-VSO-WAVE
    		SOT360-1_118ActiveHC27374HC273PW-Q100J
    ( 9353 014 56118 )
    74HCT273BQ-Q100
    DHVQFN20
    (SOT764-1)     		SOT764-1SOT764-1_115ActiveHCT273BQ74HCT273BQ-Q100X
    ( 9353 014 61115 )
    74HCT273D-Q100
    SO20
    (SOT163-1)     		SOT163-1WAVE_BG-BD-1
    		SOT163-1_118Active74HCT273D74HCT273D-Q100J
    ( 9353 014 58118 )
    74HCT273PW-Q100
    TSSOP20
    (SOT360-1)     		SOT360-1SSOP-TSSOP-VSO-WAVE
    		SOT360-1_118ActiveHCT27374HCT273PW-Q100J
    ( 9353 014 59118 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74HC273BQ-Q10074HC273BQ-Q100X74HC273BQ-Q100Always Pb-free
    74HC273D-Q10074HC273D-Q100J74HC273D-Q100Always Pb-free
    74HC273PW-Q10074HC273PW-Q100J74HC273PW-Q100Always Pb-free
    74HCT273BQ-Q10074HCT273BQ-Q100X74HCT273BQ-Q100Always Pb-free
    74HCT273D-Q10074HCT273D-Q100J74HCT273D-Q100Always Pb-free
    74HCT273PW-Q10074HCT273PW-Q100J74HCT273PW-Q100Always Pb-free
    品质及可靠性免责声明

    文档 (9)

    文件名称标题类型日期
    74HC_HCT273_Q100Octal D-type flip-flop with reset; positive-edge triggerData sheet2020-09-15
    AN11044Pin FMEA 74HC/74HCT familyApplication note2019-01-09
    hcHC/HCT Spice modelSPICE model2022-02-17
    HCT_USER_GUIDEHC/T User GuideUser manual1997-10-31
    SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2022-06-21
    SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
    SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2022-06-21
    SOT163-1plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm bodyPackage information2022-06-20
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    hcHC/HCT Spice modelSPICE model2022-02-17

    样品

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