可订购部件
型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
---|---|---|---|---|
74HC273PW-Q100 | 74HC273PW-Q100J | 935301456118 | SOT360-1 | 订单产品 |
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationOctal D-type flip-flop with reset; positive-edge trigger
The 74HC273-Q100; 74HCT273-Q100 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
Input levels:
For 74HC273-Q100: CMOS level
For 74HCT273-Q100: TTL level
Common clock and master reset
Eight positive edge-triggered D-type flip-flops
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
型号 | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|
74HC273PW-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 15 | 122 | low | -40~125 | 100 | 4.6 | 44.9 | TSSOP20 |
Model Name | 描述 |
---|---|
|
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74HC273PW-Q100 | 74HC273PW-Q100J (935301456118) |
Active | HC273 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT273_Q100 | Octal D-type flip-flop with reset; positive-edge trigger | Data sheet | 2020-09-15 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
SOT360-1_118 | TSSOP20; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2023-08-30 |
74HC273PW-Q100_Nexperia_Product_Reliability | 74HC273PW-Q100 Nexperia Product Reliability | Quality document | 2023-05-29 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
---|---|---|---|---|---|---|
74HC273PW-Q100 | 74HC273PW-Q100J | 935301456118 | Active | SOT360-1_118 | 2,500 | 订单产品 |
作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.