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    PSMN1R5-60YSN

    N-channel 60 V, 1.5 mOhm, standard level NextPowerS3 MOSFET in LFPAK56E

    NextPowerS3 family leverages “superjunction” and Schottky-Plus technologies for super-fast switching with soft body-diode recovery, delivering low spiking without compromising efficiency or IDSS leakage. This product has been designed and qualified for high performance power switching applications.

    Features and benefits

    • 250 A continuous ID(max)

    • Avalanche rated, 100% tested

    • High reliability LFPAK (Power SO8) package, qualified to 175 °C

    • LFPAK copper clip:

      • Improved thermal dissipation and even current distribution

      • Reduced electrical and thermal resistance

    • LFPAK gull wing lead:

      • Enhanced wetting area for solder coverage and visual soldering inspection

      • High Board Level Reliability, absorbing thermal expansion and mechanical strain

    Applications

    • eFuse

    • Battery protection

    • Motor control

    • Power supply for servers and telecoms

    • DC-to-DC converters

    参数类型

    型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) VGSth [typ] (V) Release date
    PSMN1R5-60YSN SOT1023 LFPAK56E; Power-SO8 Development N 1 60 1.5 175 250 79 236 250 3 2024-04-26

    文档 (7)

    文件名称 标题 类型 日期
    PSMN1R5-60YSN N-channel 60 V, 1.5 mOhm, standard level NextPowerS3 MOSFET in LFPAK56E Data sheet 2024-04-29
    AN90032 Low temperature soldering, application study Application note 2022-02-22
    SOT1023 3D model for products with SOT1023 package Design support 2017-06-29
    Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
    LFPAK56_SOT1023_mk plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch; 4.58 mm x 5.13 mm x 1.03 mm body Marcom graphics 2017-01-28
    SOT1023 plastic, single-ended surface-mounted package (LFPAK56E); 4 leads; 1.27 mm pitch Package information 2024-02-06
    REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

    模型

    文件名称 标题 类型 日期
    SOT1023 3D model for products with SOT1023 package Design support 2017-06-29

    订购、定价与供货

    样品

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    How does it work?

    The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

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