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    BCP56H

    80 V, 1 A NPN medium power transistor

    NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

    Table 1. Product Overview

    Type number

    Package

    PNP complement

    Nexperia

    JEITA

    JEDEC

    BCP56H

    SOT223

    SC-73

    -

    BCP53H

    BCP56-10H

    BCP53-10H

    BCP56-16H

    BCP53-16H

    Features and benefits

    • High collector current capability IC and ICM

    • Three current gain selections

    • High power dissipation capability

    • High-temperature applications up to 175 °C

    • AEC-Q101 qualified

    Applications

    • Linear voltage regulators

    • MOSFET drivers

    • Low-side switches

    • Power management

    • Amplifiers

    参数类型

    型号 Package version Package name Size (mm) Polarity Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] Tj [max] (°C) fT [min] (MHz)
    BCP56H SOT223 SC-73 6.5 x 3.5 x 1.65 NPN 725 80 1000 63 250 175 100

    封装

    型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
    BCP56H BCP56HX
    (934070289115)
    Active BCP56H SOT223
    SC-73
    (SOT223)
    SOT223 REFLOW_BG-BD-1
    WAVE_BG-BD-1
    SOT223_115

    环境信息

    型号 可订购的器件编号 化学成分 RoHS RHF指示符
    BCP56H BCP56HX BCP56H rohs rhf rhf
    品质及可靠性免责声明

    Series

    文档 (11)

    文件名称 标题 类型 日期
    BCP56H_SER 80 V, 1 A NPN medium power transistors Data sheet 2018-11-19
    SOT223 3D model for products with SOT223 package Design support 2019-01-22
    Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
    SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
    SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
    SOT223_115 SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation Packing information 2024-02-15
    BCP56H_Nexperia_Product_Quality BCP56H Nexperia Product Quality Quality document 2019-05-20
    BCP56H_Nexperia_Product_Reliability BCP56H Nexperia Product Reliability Quality document 2024-04-23
    REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
    BCP56H BCP56H SPICE model SPICE model 2024-04-05
    WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

    支持

    如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

    模型

    文件名称 标题 类型 日期
    BCP56H BCP56H SPICE model SPICE model 2024-04-05
    SOT223 3D model for products with SOT223 package Design support 2019-01-22

    订购、定价与供货

    型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
    BCP56H BCP56HX 934070289115 Active SOT223_115 1,000 订单产品

    样品

    作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。

    如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。

    How does it work?

    The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

    可订购部件

    型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
    BCP56H BCP56HX 934070289115 SOT223 订单产品
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