特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Balanced propagation delays
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All inputs have Schmitt-trigger actions
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Inputs accept voltages higher than VCC
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Input levels:
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For 74AHC30-Q100: CMOS level
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For 74AHCT30-Q100: TTL level
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
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74AHC30BQ-Q100 | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 108 | 22.7 | 76 | DHVQFN14 |
74AHC30D-Q100 | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 111 | 21.9 | 69 | SO14 |
74AHC30PW-Q100 | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 143 | 8.5 | 69 | TSSOP14 |
74AHCT30BQ-Q100 | Production | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 108 | 22.7 | 76 | DHVQFN14 |
74AHCT30D-Q100 | Production | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 111 | 21.9 | 69 | SO14 |
74AHCT30PW-Q100 | Production | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 143 | 8.5 | 69 | TSSOP14 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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74AHC30BQ-Q100 | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | AHC30 | 74AHC30BQ-Q100X ( 9353 031 87115 ) | |
74AHC30D-Q100 | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74AHC30D | 74AHC30D-Q100J ( 9353 013 89118 ) |
74AHC30PW-Q100 | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | AHC30 | 74AHC30PW-Q100J ( 9353 031 86118 ) |
74AHCT30BQ-Q100 | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | AHT30 | 74AHCT30BQ-Q100X ( 9353 013 85115 ) | |
74AHCT30D-Q100 | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74AHCT30D | 74AHCT30D-Q100J ( 9353 012 07118 ) |
74AHCT30PW-Q100 | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | AHCT30 | 74AHCT30PW-Q100J ( 9353 013 86118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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74AHC30BQ-Q100 | 74AHC30BQ-Q100X | 74AHC30BQ-Q100 | Always Pb-free | ||
74AHC30D-Q100 | 74AHC30D-Q100J | 74AHC30D-Q100 | Always Pb-free | ||
74AHC30PW-Q100 | 74AHC30PW-Q100J | 74AHC30PW-Q100 | Always Pb-free | ||
74AHCT30BQ-Q100 | 74AHCT30BQ-Q100X | 74AHCT30BQ-Q100 | Always Pb-free | ||
74AHCT30D-Q100 | 74AHCT30D-Q100J | 74AHCT30D-Q100 | Always Pb-free | ||
74AHCT30PW-Q100 | 74AHCT30PW-Q100J | 74AHCT30PW-Q100 | Always Pb-free |
文档 (10)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AHC_AHCT30_Q100 | 8-input NAND gate | Data sheet | 2024-03-07 |
ahct30 | 74AHCT30 IBIS model | IBIS model | 2015-08-30 |
ahc30 | 74AHC30 IBIS model | IBIS model | 2015-08-30 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
支持
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样品
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