特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range from 2.0 V to 5.5 V
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Input levels:
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For 74AHC08-Q100: CMOS level
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For 74AHCT08-Q100: TTL level
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Balanced propagation delays
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All inputs have a Schmitt-trigger action
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Overvoltage tolerant inputs to 5.5 V
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High noise immunity
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CMOS low power dissipation
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC08BQ-Q100 | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.5 | 60 | 4 | low | -40~125 | 103 | 18.4 | 71 | DHVQFN14 |
| 74AHC08D-Q100 | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.5 | 60 | 4 | low | -40~125 | 105 | 17.8 | 63 | SO14 |
| 74AHC08PW-Q100 | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.5 | 60 | 4 | low | -40~125 | 138 | 6.9 | 64 | TSSOP14 |
| 74AHCT08BQ-Q100 | Production | 4.5 - 5.5 | TTL | ± 8 | 5 | 60 | 4 | low | -40~125 | 103 | 18.4 | 71 | DHVQFN14 |
| 74AHCT08D-Q100 | Production | 4.5 - 5.5 | TTL | ± 8 | 5 | 60 | 4 | low | -40~125 | 105 | 17.8 | 63 | SO14 |
| 74AHCT08PW-Q100 | Production | 4.5 - 5.5 | TTL | ± 8 | 5 | 60 | 4 | low | -40~125 | 138 | 6.9 | 64 | TSSOP14 |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| 74AHC08BQ-Q100 |  DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | AHC08 | 74AHC08BQ-Q100X ( 9353 009 83115 ) | |
| 74AHC08D-Q100 |  SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74AHC08D | 74AHC08D-Q100J ( 9353 009 58118 ) |
| 74AHC08PW-Q100 |  TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | AHC08 | 74AHC08PW-Q100J ( 9353 009 59118 ) |
| 74AHCT08BQ-Q100 | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | AHT08 | 74AHCT08BQ-Q100X ( 9353 009 84115 ) | |
| 74AHCT08D-Q100 | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74AHCT08D | 74AHCT08D-Q100J ( 9353 009 61118 ) |
| 74AHCT08PW-Q100 | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | AHCT08 | 74AHCT08PW-Q100J ( 9353 009 62118 ) |
停产信息
| 型号 | 可订购的器件编号，（订购码(12NC)） | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
|---|---|---|---|---|---|---|
| 74AHC08D-Q100/AU | 935690652118 | 2018-12-31 | 2019-06-30 | 74AHC08D-Q100 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| 74AHC08BQ-Q100 | 74AHC08BQ-Q100X | 74AHC08BQ-Q100 |  |   | Always Pb-free |
| 74AHC08D-Q100 | 74AHC08D-Q100J | 74AHC08D-Q100 | | | Always Pb-free |
| 74AHC08PW-Q100 | 74AHC08PW-Q100J | 74AHC08PW-Q100 | | | Always Pb-free |
| 74AHCT08BQ-Q100 | 74AHCT08BQ-Q100X | 74AHCT08BQ-Q100 | | | Always Pb-free |
| 74AHCT08D-Q100 | 74AHCT08D-Q100J | 74AHCT08D-Q100 | | | Always Pb-free |
| 74AHCT08PW-Q100 | 74AHCT08PW-Q100J | 74AHCT08PW-Q100 | | | Always Pb-free |
文档 (10)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT08_Q100 | Quad 2-input AND gate | Data sheet | 2024-02-05 |
| ahc08 | ahc08 IBIS model | IBIS model | 2013-04-07 |
| ahct08 | ahct08 IBIS model | IBIS model | 2013-04-07 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
支持
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