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74HC165-Q100; 74HCT165-Q100

8-bit parallel-in/serial out shift register

The 74HC165-Q100; 74HCT165-Q100 are 8-bit serial or parallel-in/serial-out shift registers. The device features a serial data input (DS), eight parallel data inputs (D0 to D7) and two complementary serial outputs (Q7 and Q7). When the parallel load input (PL) is LOW the data from D0 to D7 is loaded into the shift register asynchronously. When PL is HIGH data enters the register serially at DS. When the clock enable input (CE) is LOW data is shifted on the LOW-to-HIGH transitions of the CP input. A HIGH on CE will disable the CP input. Inputs are overvoltage tolerant to 15 V. This enables the device to be used in HIGH-to-LOW level shifting applications.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

特性

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Asynchronous 8-bit parallel load

  • Synchronous serial input

  • Complies with JEDEC standard no. 7A

  • Input levels:

    • For 74HC165-Q100: CMOS level

    • For 74HCT165-Q100: TTL level

  • ESD protection:

    • MIL-STD-883, method 3015 exceeds 2000 V

    • HBM JESD22-A114F exceeds 2000 V

    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

目标应用

  • Parallel-to-serial data conversion

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74HC165BQ-Q100Production2.0 - 6.0CMOS± 5.21656low-40~1259112.760DHVQFN16
74HC165D-Q100Production2.0 - 6.0CMOS± 5.21656low-40~125918.950SO16
74HC165PW-Q100Production2.0 - 6.0CMOS± 5.21656low-40~1251234.252.9TSSOP16
74HCT165BQ-Q100Production4.5 - 5.5TTL± 41448low-40~1259112.760DHVQFN16
74HCT165D-Q100Production4.5 - 5.5TTL± 41448low-40~125918.950SO16
74HCT165PW-Q100Production4.5 - 5.5TTL± 41548low-40~1251234.252.9TSSOP16

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74HC165BQ-Q100
DHVQFN16
(SOT763-1) 		SOT763-1SOT763-1_115ActiveHC16574HC165BQ-Q100,115
( 9352 987 66115 )
74HC165D-Q100
SO16
(SOT109-1) 		SOT109-1SO-SOJ-REFLOW
SO-SOJ-WAVE
SOT109-1_118Active74HC165D74HC165D-Q100,118
( 9352 987 67118 )
74HC165PW-Q100
TSSOP16
(SOT403-1) 		SOT403-1SSOP-TSSOP-VSO-WAVE
SOT403-1_118ActiveHC16574HC165PW-Q100,118
( 9352 987 68118 )
74HCT165BQ-Q100
DHVQFN16
(SOT763-1) 		SOT763-1SOT763-1_115ActiveHCT16574HCT165BQ-Q100,11
( 9352 987 69115 )
74HCT165D-Q100
SO16
(SOT109-1) 		SOT109-1SO-SOJ-REFLOW
SO-SOJ-WAVE
SOT109-1_118Active74HCT165D74HCT165D-Q100,118
( 9352 987 71118 )
74HCT165PW-Q100
TSSOP16
(SOT403-1) 		SOT403-1SSOP-TSSOP-VSO-WAVE
SOT403-1_118ActiveHCT16574HCT165PW-Q100,11
( 9352 987 72118 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74HC165BQ-Q10074HC165BQ-Q100,11574HC165BQ-Q100Always Pb-free
74HC165D-Q10074HC165D-Q100,11874HC165D-Q100Always Pb-free
74HC165PW-Q10074HC165PW-Q100,11874HC165PW-Q100Always Pb-free
74HCT165BQ-Q10074HCT165BQ-Q100,1174HCT165BQ-Q100Always Pb-free
74HCT165D-Q10074HCT165D-Q100,11874HCT165D-Q100Always Pb-free
74HCT165PW-Q10074HCT165PW-Q100,1174HCT165PW-Q100Always Pb-free
品质及可靠性免责声明

文档 (12)

文件名称标题类型日期
74HC_HCT165_Q1008-bit parallel-in/serial out shift registerData sheet2024-05-30
AN11044Pin FMEA 74HC/74HCT familyApplication note2019-01-09
hc16574HC165 IBIS modelIBIS model2015-09-13
hct16574HCT165 IBIS modelIBIS model2015-09-13
HCT_USER_GUIDEHC/T User GuideUser manual1997-10-31
SOT763-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm bodyPackage information2023-05-11
SO-SOJ-WAVEFootprint for wave solderingWave soldering2009-10-08
SO-SOJ-REFLOWFootprint for reflow solderingReflow soldering2009-10-08
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT109-1plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm bodyPackage information2023-11-07
SOT403-1plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm bodyPackage information2023-11-08
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08

支持

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模型

文件名称标题类型日期
hc16574HC165 IBIS modelIBIS model2015-09-13
hct16574HCT165 IBIS modelIBIS model2015-09-13

样品

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