特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 3)
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Specified from -40 °C to +85 °C
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Octal bus interface
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3-state buffers
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Output capability: +64 mA and -32 mA
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TTL input and output switching levels
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Input and output interface capability to systems at 5 V supply
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Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
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Live insertion and extraction permitted
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Power-up 3-state
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No bus current loading when output is tied to 5 V bus
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Latch-up protection
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JESD78 Class II exceeds 500 mA
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ESD protection:
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MIL-STD-883, method 3015 exceeds 2000 V
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HBM JESD22-A114F exceeds 2000 V
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MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVT244ABQ-Q100 | Production | 2.7 - 3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 77 | 7.9 | 48 | DHVQFN20 |
74LVT244AD-Q100 | Production | 2.7 - 3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 84 | 26.3 | 60 | SO20 |
74LVT244APW-Q100 | Production | 2.7 - 3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 100 | 4.4 | 44 | TSSOP20 |
74LVTH244ABQ-Q100 | Production | 2.7 - 3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 77 | 7.9 | 48 | DHVQFN20 |
74LVTH244AD-Q100 | Production | 2.7 - 3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 84 | 26.3 | 60 | SO20 |
74LVTH244APW-Q100 | Production | 2.7 - 3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 100 | 4.4 | 44 | TSSOP20 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LVT244ABQ-Q100 | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | LVT244A | 74LVT244ABQ-Q100X ( 9353 020 78115 ) | |
74LVT244AD-Q100 | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_118 | Active | 74LVT244AD | 74LVT244AD-Q100J ( 9353 004 69118 ) |
74LVT244APW-Q100 | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | LVT244A | 74LVT244APW-Q100J ( 9353 004 71118 ) |
74LVTH244ABQ-Q100 | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | LVTH244A | 74LVTH244ABQ-Q100X ( 9353 020 77115 ) | |
74LVTH244AD-Q100 | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_118 | Active | 74LVTH244AD | 74LVTH244AD-Q100J ( 9353 016 23118 ) |
74LVTH244APW-Q100 | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | VTH244A | 74LVTH244APW-Q100J ( 9353 016 24118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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74LVT244ABQ-Q100 | 74LVT244ABQ-Q100X | 74LVT244ABQ-Q100 | Always Pb-free | ||
74LVT244AD-Q100 | 74LVT244AD-Q100J | 74LVT244AD-Q100 | Always Pb-free | ||
74LVT244APW-Q100 | 74LVT244APW-Q100J | 74LVT244APW-Q100 | Always Pb-free | ||
74LVTH244ABQ-Q100 | 74LVTH244ABQ-Q100X | 74LVTH244ABQ-Q100 | Always Pb-free | ||
74LVTH244AD-Q100 | 74LVTH244AD-Q100J | 74LVTH244AD-Q100 | Always Pb-free | ||
74LVTH244APW-Q100 | 74LVTH244APW-Q100J | 74LVTH244APW-Q100 | Always Pb-free |
文档 (9)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVT_LVTH244A_Q100 | 3.3 V octal buffer/line driver; 3-state | Data sheet | 2020-08-24 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
lvt244a | lvt244a IBIS model | IBIS model | 2013-04-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
样品
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