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74LVC1G17-Q100

Single Schmitt trigger buffer

The 74LVC1G17-Q100 is a single buffer Schmitt-trigger. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

特性

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • CMOS low power dissipation

  • IOFF circuitry provides partial Power-down mode operation

  • ±24 mA output drive (VCC = 3.0 V)

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Unlimited rise and fall times

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G17GM-Q100Production1.65 - 5.5CMOS/LVTTL± 321751low-40~1253208.2163XSON6
74LVC1G17GV-Q100Production1.65 - 5.5CMOS/LVTTL± 321751low-40~12527868.5175TSOP5
74LVC1G17GW-Q100Production1.65 - 5.5CMOS/LVTTL± 321751low-40~12531988.0188TSSOP5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
74LVC1G17GM-Q100
XSON6
(SOT886)
SOT886REFLOW_BG-BD-1
SOT886_115ActiveVJ74LVC1G17GM-Q100X
( 9356 907 64115 )
74LVC1G17GV-Q100
TSOP5
(SOT753)
SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActiveV1774LVC1G17GV-Q100,1
( 9352 984 82125 )
74LVC1G17GW-Q100
TSSOP5
(SOT353-1)
SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveVJ74LVC1G17GW-Q100,1
( 9352 984 83125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G17GM-Q10074LVC1G17GM-Q100X74LVC1G17GM-Q100week 25, 2019
74LVC1G17GV-Q10074LVC1G17GV-Q100,174LVC1G17GV-Q100Always Pb-free
74LVC1G17GW-Q10074LVC1G17GW-Q100,174LVC1G17GW-Q100Always Pb-free
品质及可靠性免责声明

文档 (12)

文件名称标题类型日期
74LVC1G17_Q100Single Schmitt trigger bufferData sheet2023-08-15
lvc1g1774LVC1G17 IBIS modelIBIS model2018-05-25
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
lvc1g1774LVC1G17 IBIS modelIBIS model2018-05-25

样品

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