特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range from 1.65 V to 5.5 V
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Overvoltage tolerant inputs to 5.5 V
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High noise immunity
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CMOS low power consumption
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IOFF circuitry provides partial Power-down mode operation
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-24 mA output drive (VCC = 3.0 V)
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Latch-up performance exceeds 250 mA
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Direct interface with TTL levels
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Complies with JEDEC standard:
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
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74LVC1G07GS-Q100 | Production | 1.65 - 5.5 | CMOS/LVTTL | 32 | 175 | 1 | low | -40~125 | 341 | 34.6 | 231 | XSON6 |
74LVC1G07GV-Q100 | Production | 1.65 - 5.5 | CMOS/LVTTL | 32 | 175 | 1 | low | -40~125 | 278 | 68.5 | 175 | TSOP5 |
74LVC1G07GW-Q100 | Production | 1.65 - 5.5 | CMOS/LVTTL | 32 | 175 | 1 | low | -40~125 | 319 | 88.0 | 188 | TSSOP5 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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74LVC1G07GS-Q100 | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_125 | Active | VS | 74LVC1G07GS-Q100H ( 9356 907 78125 ) |
74LVC1G07GV-Q100 | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | V07 | 74LVC1G07GV-Q100H ( 9353 009 06125 ) |
74LVC1G07GW-Q100 | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | VS | 74LVC1G07GW-Q100H ( 9353 009 07125 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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74LVC1G07GS-Q100 | 74LVC1G07GS-Q100H | 74LVC1G07GS-Q100 | week 25, 2019 | ||
74LVC1G07GV-Q100 | 74LVC1G07GV-Q100H | 74LVC1G07GV-Q100 | Always Pb-free | ||
74LVC1G07GW-Q100 | 74LVC1G07GW-Q100H | 74LVC1G07GW-Q100 | Always Pb-free |
文档 (15)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC1G07_Q100 | Buffer with open-drain output | Data sheet | 2023-09-28 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc1g07 | 74LVC1G07 IBIS model | IBIS model | 2018-05-25 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
样品
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