特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range from 2.0 to 6.0 V
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CMOS low power dissipation
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High noise immunity
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Input levels:
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For 74HC244-Q100: CMOS level
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For 74HCT244-Q100: TTL level
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Octal bus interface
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Non-inverting 3-state outputs
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Complies with JEDEC standards:
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JESD8C (2.7 V to 3.6 V)
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JESD7A (2.0 V to 6.0 V)
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ESD protection:
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MIL-STD-883, method 3015 exceeds 2 kV
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HBM JESD22-A114F exceeds 2 kV
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MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|
74HC244BQ-Q100 | Production | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | 78 | 9.4 | 50 | DHVQFN20 |
74HC244D-Q100 | Production | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | 85 | 27.5 | 61 | SO20 |
74HC244PW-Q100 | Production | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | 100 | 4.6 | 44.9 | TSSOP20 |
74HCT244BQ-Q100 | Production | 4.5 - 5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | 78 | 9.4 | 50 | DHVQFN20 |
74HCT244D-Q100 | Production | 4.5 - 5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | 85 | 27.5 | 61 | SO20 |
74HCT244PW-Q100 | Production | 4.5 - 5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | 100 | 4.6 | 44.9 | TSSOP20 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74HC244BQ-Q100 | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | HC244 | 74HC244BQ-Q100,115 ( 9352 989 12115 ) | |
74HC244D-Q100 | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_118 | Active | 74HC244D | 74HC244D-Q100,118 ( 9352 989 13118 ) |
74HC244PW-Q100 | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | HC244 | 74HC244PW-Q100,118 ( 9352 989 14118 ) |
74HCT244BQ-Q100 | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | HCT244 | 74HCT244BQ-Q100,11 ( 9352 989 15115 ) | |
74HCT244D-Q100 | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_118 | Active | 74HCT244D | 74HCT244D-Q100,118 ( 9352 989 16118 ) |
74HCT244PW-Q100 | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | HCT244 | 74HCT244PW-Q100,11 ( 9352 989 17118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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74HC244BQ-Q100 | 74HC244BQ-Q100,115 | 74HC244BQ-Q100 | Always Pb-free | ||
74HC244D-Q100 | 74HC244D-Q100,118 | 74HC244D-Q100 | Always Pb-free | ||
74HC244PW-Q100 | 74HC244PW-Q100,118 | 74HC244PW-Q100 | Always Pb-free | ||
74HCT244BQ-Q100 | 74HCT244BQ-Q100,11 | 74HCT244BQ-Q100 | Always Pb-free | ||
74HCT244D-Q100 | 74HCT244D-Q100,118 | 74HCT244D-Q100 | Always Pb-free | ||
74HCT244PW-Q100 | 74HCT244PW-Q100,11 | 74HCT244PW-Q100 | Always Pb-free |
文档 (11)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT244_Q100 | Octal buffer/line driver; 3-state | Data sheet | 2021-07-28 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
样品
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