特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide operating voltage 2.0 V to 6.0 V
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CMOS input levels
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Latch-up performance exceeds 100 mA per JESD 78 Class II level A
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Complies with JEDEC standard no. 7A
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC05BQ-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 36 | 6 | low | -40~125 | 107 | 21.9 | 75 | DHVQFN14 |
| 74HC05D-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 36 | 6 | low | -40~125 | 110 | 21.1 | 68 | SO14 |
| 74HC05PW-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 36 | 6 | low | -40~125 | 142 | 8.16 | 68.4400442477876 | TSSOP14 |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| 74HC05BQ-Q100 |  DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | HC05 | 74HC05BQ-Q100,115 ( 9352 987 34115 ) | |
| 74HC05D-Q100 |  SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74HC05D | 74HC05D-Q100,118 ( 9352 987 35118 ) |
| 74HC05PW-Q100 |  TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | HC05 | 74HC05PW-Q100,118 ( 9352 987 36118 ) |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| 74HC05BQ-Q100 | 74HC05BQ-Q100,115 | 74HC05BQ-Q100 |  |   | Always Pb-free |
| 74HC05D-Q100 | 74HC05D-Q100,118 | 74HC05D-Q100 | | | Always Pb-free |
| 74HC05PW-Q100 | 74HC05PW-Q100,118 | 74HC05PW-Q100 | | | Always Pb-free |
文档 (12)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74HC05_Q100 | Hex inverter with open-drain outputs | Data sheet | 2024-03-14 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
样品
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