NG体育娱乐，ng体育平台

×

74AUP1T34-Q100

Low-power dual supply translating buffer

The 74AUP1T34-Q100 is a single dual supply translating buffer. Input A is referenced to VCC(A) and output Y is referenced to VCC(Y). Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 1.1 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

特性

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

  • Wide supply voltage range from 1.1 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Wide supply voltage range:

    • VCC(A): 1.1 V to 3.6 V

    • VCC(Y): 1.1 V to 3.6 V

  • Low static power consumption; ICC = 0.9 µA (maximum)

  • Each port operates over the full 1.1 V to 3.6 V power supply range

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1T34GM-Q100Productionn.a.CMOS± 1.9701ultra low-40~1253238.4164XSON6
74AUP1T34GW-Q100Productionn.a.CMOS± 1.9-1ultra low-40~12529265.6165TSSOP5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1T34GM-Q100
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_115ActivepQ74AUP1T34GM-Q100X
( 9356 907 66115 )
74AUP1T34GW-Q100
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActivepQ74AUP1T34GW-Q100H
( 9353 020 98125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1T34GM-Q10074AUP1T34GM-Q100X74AUP1T34GM-Q100week 25, 2019
74AUP1T34GW-Q10074AUP1T34GW-Q100H74AUP1T34GW-Q100Always Pb-free
品质及可靠性免责声明

文档 (9)

文件名称标题类型日期
74AUP1T34_Q100Low-power dual supply translating bufferData sheet2023-07-17
aup1t3474AUP1T34 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

模型

文件名称标题类型日期
aup1t3474AUP1T34 IBIS modelIBIS model2014-12-14

订购、定价与供货

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品

NG体育娱乐，ng体育平台