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BC56XPAS-Q series

80 V, 1 A PNP medium power transistors

NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

特性

  • High collector current capability IC and ICM

  • Reduced Printed-Circuit Board (PCB) area requirements

  • Exposed heat sink for excellent thermal and electrical conductivity

  • Two current gain selections

  • Leadless very small SMD plastic package with medium power capability

  • Suitable for Automatic Optical Inspection (AOI) of solder joint

  • Qualified according to AEC-Q101 and recommended for use in automotive applications

目标应用

  • Linear voltage regulators

  • Battery driven devices

  • MOSFET drivers

  • High-side switches

  • Power management

  • Amplifiers

参数类型

Type numberPackage versionPackage nameSize (mm)
BC56-10PAS-QSOT1061DDFN2020D-32 x 2 x 0.65
BC56-16PAS-QSOT1061DDFN2020D-32 x 2 x 0.65
BC56PAS-QSOT1061DDFN2020D-32 x 2 x 0.65

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
BC56-10PAS-Q
DFN2020D-3
(SOT1061D)
SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveCLBC56-10PAS-QX
( 9346 680 15115 )
BC56-16PAS-Q
DFN2020D-3
(SOT1061D)
SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveCMBC56-16PAS-QX
( 9346 680 14115 )
BC56PAS-Q
DFN2020D-3
(SOT1061D)
SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveCKBC56PAS-QX
( 9346 680 16115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
BC56-10PAS-QBC56-10PAS-QXBC56-10PAS-Q
BC56-16PAS-QBC56-16PAS-QXBC56-16PAS-Q
BC56PAS-QBC56PAS-QXBC56PAS-Q
品质及可靠性免责声明

文档 (3)

文件名称标题类型日期
BC56XPAS-Q_SER80 V, 1 A NPN medium power transistorsData sheet2024-05-28
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1061Dplastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm bodyPackage information2022-10-10

支持

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订购、定价与供货

样品

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样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品

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