特性
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High collector current capability IC and ICM
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Reduced Printed-Circuit Board (PCB) area requirements
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Exposed heat sink for excellent thermal and electrical conductivity
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Two current gain selections
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Leadless very small SMD plastic package with medium power capability
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Suitable for Automatic Optical Inspection (AOI) of solder joint
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Qualified according to AEC-Q101 and recommended for use in automotive applications
目标应用
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Linear voltage regulators
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Battery driven devices
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MOSFET drivers
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High-side switches
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Power management
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Amplifiers
参数类型
| Type number | Package version | Package name | Size (mm) | Ptot [max] (W) | Polarity | VCEO [max] (V) | IC [max] (A) | hFE [min] | hFE [max] | fT [typ] (MHz) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC55-10PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | 0.42 | NPN | 60 | 1 | 63 | 160 | 180 | 100 | Y |
| BC55-16PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | 0.42 | NPN | 60 | 1 | 100 | 250 | 180 | 100 | Y |
| BC55PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | 0.42 | NPN | 60 | 1 | 63 | 250 | 180 | 100 | Y |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| BC55-10PAS-Q |  DFN2020D-3 (SOT1061D) | SOT1061D | REFLOW_BG-BD-1 | SOT1061D_115 | Active | CH | BC55-10PAS-QX ( 9346 661 33115 ) |
| BC55-16PAS-Q | DFN2020D-3 (SOT1061D) | SOT1061D | REFLOW_BG-BD-1 | SOT1061D_115 | Active | CJ | BC55-16PAS-QX ( 9346 661 34115 ) |
| BC55PAS-Q | DFN2020D-3 (SOT1061D) | SOT1061D | REFLOW_BG-BD-1 | SOT1061D_115 | Active | CG | BC55PAS-QX ( 9346 648 95115 ) |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| BC55-10PAS-Q | BC55-10PAS-QX | BC55-10PAS-Q |  |   | |
| BC55-16PAS-Q | BC55-16PAS-QX | BC55-16PAS-Q | | | |
| BC55PAS-Q | BC55PAS-QX | BC55PAS-Q | | |
文档 (3)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BC55XPAS-Q_SER | 60 V, 1 A NPN medium power transistors | Data sheet | 2023-05-02 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
支持
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样品
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