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    BCP52T

    60 V, 1 A PNP medium power transistors

    PNP medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

    Table 1. Table 1. Product Overview

    Type number

    Package

    NPN complement

    Nexperia

    JEITA

    JEDEC

    BCP52T

    SOT223

    SC-73

    -

    BCP55T

    BCP52-10T

    BCP55-10T

    BCP52-16T

    BCP55-16T

    Features and benefits

    • High collector current capability IC and ICM
    • Three current gain selections
    • High power dissipation capability
    • AEC-Q101 qualified

    Applications

    • Linear voltage regulators
    • MOSFET drivers
    • High-side switches
    • Power management
    • Amplifiers

    参数类型

    型号 Package version Package name Size (mm) Polarity Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] Tj [max] (°C) fT [min] (MHz)
    BCP52T SOT223 SC-73 6.5 x 3.5 x 1.65 PNP 600 -60 -1000 63 250 150 100

    封装

    型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
    BCP52T BCP52TF
    (934661079135)
    Active BCP52T SOT223
    SC-73
    (SOT223)
    SOT223 REFLOW_BG-BD-1
    WAVE_BG-BD-1
    SOT223_135

    环境信息

    型号 可订购的器件编号 化学成分 RoHS RHF指示符
    BCP52T BCP52TF BCP52T rohs rhf rhf
    品质及可靠性免责声明

    文档 (10)

    文件名称 标题 类型 日期
    BCP52T_SER 60 V, 1 A PNP medium power transistors Data sheet 2019-04-29
    SOT223 3D model for products with SOT223 package Design support 2019-01-22
    Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
    SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
    SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
    SOT223_135 SC-73; Reel pack for SMD, 13"; Q3/T4 product orientation Packing information 2024-02-15
    BCP52T_Nexperia_Product_Reliability BCP52T Nexperia Product Reliability Quality document 2024-04-23
    REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
    BCP52T BCP52T SPICE model SPICE model 2024-04-05
    WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

    支持

    如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

    模型

    文件名称 标题 类型 日期
    BCP52T BCP52T SPICE model SPICE model 2024-04-05
    SOT223 3D model for products with SOT223 package Design support 2019-01-22

    订购、定价与供货

    型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
    BCP52T BCP52TF 934661079135 Active SOT223_135 4,000 订单产品

    样品

    作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。

    如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。

    How does it work?

    The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

    可订购部件

    型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
    BCP52T BCP52TF 934661079135 SOT223 订单产品
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