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    NXT4559

    SIM card interface level translator

    The NXT4559 device is built for interfacing a SIM card with a single low-voltage host side interface. The NXT4559 has three level translators to convert the data, RST and CLK signals between a SIM card and a host microcontroller. A high speed level translation capable of supporting class-B, class-C SIM cards. VCC_SIM power-down initiates a shutdown sequence on SIM card pins in accordance with ISO-7816-3.

    The NXT4559 is compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart card interface requirements.

    特性

    • Support SIM cards and eSIM with supply voltages 1.62 V to 3.3 V

    • Host micro-controller operating voltage range: 1.08 V to 1.98 V

    • Automatic level translation of I/O, RST and CLK between SIM card and host side interface with capacitance isolation

    • Incorporates shutdown feature for the SIM card signals according to ISO-7816-3

    • High Vdis(UVLO_AC) switching level, arranging quick shut down when VCC_SIM powers down

    • Integrated pull-up resistors; no external resistor required

    • Integrated EMI Filters suppresses higher harmonics of digital I/O's

    • Low current shutdown mode < 1 μA

    • Supports clock speed beyond 5 MHz clock

    • Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)

    • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

      • IEC61000-4-2 level 4, contact and air discharge on all SIM card-side pins exceeds 8 kV and 15 kV

    • Available in 9-pin wafer level chip-scale package (WLCSP); 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body; 0.35 mm pitch

    • Specified from -40 °C to +85 °C

    目标应用

    • NXT4559 can be used with a range of SIM card attached devices including:

      • mobiles and personal phoness

      • Wireless modems

      • SIM card terminals

    参数类型

    Type numberProduct statusPackage name
    NXT4559UPProductionWLCSP9

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
    NXT4559UP
    WLCSP9
    (SOT8027-1)
    SOT8027-1SOT8027-1_336Activez9NXT4559UPZ
    ( 9356 917 09336 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    NXT4559UPNXT4559UPZNXT4559UP
    品质及可靠性免责声明

    文档 (3)

    文件名称标题类型日期
    NXT4559SIM card interface level translatorData sheet2024-02-27
    nxt4559upNXT4559UP IBIS modelIBIS model2023-12-21
    SOT8027-1wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm bodyPackage information2022-09-27

    支持

    如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    nxt4559upNXT4559UP IBIS modelIBIS model2023-12-21

    订购、定价与供货

    样品

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