特性
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Wide supply voltage range from 1.65 V to 5.5 V
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Overvoltage tolerant inputs to 5.5 V
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High noise immunity
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CMOS low power dissipation
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5 V tolerant outputs in the Power-down mode
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±24 mA output drive (VCC = 3.0 V)
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Latch-up performance exceeds 250 mA
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Direct interface with TTL levels
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IOFF circuitry provides partial Power-down mode operation
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Complies with JEDEC standard:
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC2G32DC | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.2 | 150 | 2 | low | -40~125 | 200 | 32.4 | 110 | VSSOP8 |
74LVC2G32DP | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.2 | 150 | 2 | low | -40~125 | 210 | 18.8 | 104 | TSSOP8 |
74LVC2G32GN | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.2 | 150 | 2 | low | -40~125 | 231 | 9.5 | 142 | XSON8 |
74LVC2G32GS | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.2 | 150 | 2 | low | -40~125 | 269 | 9.7 | 141 | XSON8 |
74LVC2G32GT | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.2 | 150 | 2 | low | -40~125 | 317 | 5.6 | 150 | XSON8 |
74LVC2G32GX | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.2 | 150 | 2 | low | -40~125 | - | - | - | X2SON8 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LVC2G32DC | VSSOP8 (SOT765-1) | SOT765-1 | SOT765-1_125 | Active | V32 | 74LVC2G32DC,125 ( 9352 749 76125 ) | |
74LVC2G32DP | TSSOP8 (SOT505-2) | SOT505-2 | SOT505-2_125 | Active | V32 | 74LVC2G32DP,125 ( 9352 735 83125 ) | |
74LVC2G32GN | XSON8 (SOT1116) | SOT1116 | REFLOW_BG-BD-1 | SOT1116_115 | Active | VG | 74LVC2G32GN,115 ( 9352 922 44115 ) |
74LVC2G32GS | XSON8 (SOT1203) | SOT1203 | REFLOW_BG-BD-1 | SOT1203_115 | Active | VG | 74LVC2G32GS,115 ( 9352 923 84115 ) |
74LVC2G32GT | XSON8 (SOT833-1) | SOT833-1 | SOT833-1_115 | Active | V32 | 74LVC2G32GT,115 ( 9352 789 22115 ) | |
74LVC2G32GX | X2SON8 (SOT1233-2) | SOT1233-2 | SOT1233-2_115 | Active | VG | 74LVC2G32GXX ( 9353 397 98115 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74LVC2G32DC | 74LVC2G32DC,125 | 74LVC2G32DC | week 1, 2005 | ||
74LVC2G32DP | 74LVC2G32DP,125 | 74LVC2G32DP | week 41, 2004 | ||
74LVC2G32GN | 74LVC2G32GN,115 | 74LVC2G32GN | Always Pb-free | ||
74LVC2G32GS | 74LVC2G32GS,115 | 74LVC2G32GS | Always Pb-free | ||
74LVC2G32GT | 74LVC2G32GT,115 | 74LVC2G32GT | Always Pb-free | ||
74LVC2G32GX | 74LVC2G32GXX | 74LVC2G32GX | week 25, 2019 |
文档 (17)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC2G32 | Dual 2-input OR gate | Data sheet | 2023-08-22 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc2g32 | 74LVC2G32 IBIS model | IBIS model | 2014-10-20 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT1233-2 | plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm | Package information | 2022-04-21 |
SOT505-2 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-03 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
样品
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