特性
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Wide supply voltage range from 1.65 V to 5.5 V
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Overvoltage tolerant inputs to 5.5 V
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High noise immunity
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CMOS low power dissipation
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IOFF circuitry provides partial Power-down mode operation
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±24 mA output drive (VCC = 3.0 V)
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Latch-up performance exceeds 250 mA
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Direct interface with TTL levels
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Complies with JEDEC standard:
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8-B/JESD36 (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C.
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC1G32GF NRND | Not for design in | - | - | - | - | - | - | - | - | - | - | - | XSON6 |
74LVC1G32GM | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | 313 | 7.8 | 158 | XSON6 |
74LVC1G32GN | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | 338 | 23.5 | 210 | XSON6 |
74LVC1G32GS | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | 325 | 29.9 | 218 | XSON6 |
74LVC1G32GV | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | 270 | 63.3 | 169 | TSOP5 |
74LVC1G32GW | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | 311 | 80.9 | 181 | TSSOP5 |
74LVC1G32GX | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | 327 | 94.5 | 195 | X2SON5 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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74LVC1G32GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | VG | 74LVC1G32GM,132 ( 9352 771 89132 ) |
SOT886_115 | Active | VG | 74LVC1G32GM,115 ( 9352 771 89115 ) | ||||
74LVC1G32GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | VG | 74LVC1G32GN,132 ( 9352 889 85132 ) |
74LVC1G32GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | VG | 74LVC1G32GS,132 ( 9352 929 09132 ) |
74LVC1G32GV | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | V32 | 74LVC1G32GV,125 ( 9352 720 13125 ) |
74LVC1G32GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | VG | 74LVC1G32GW,125 ( 9352 683 81125 ) |
74LVC1G32GX | X2SON5 (SOT1226-3) | SOT1226-3 | SOT1226-3_125 | Active | VG | 74LVC1G32GX,125 ( 9352 982 26125 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
74LVC1G32GF | 935282419132 | 2021-06-30 | 2021-12-31 | 74LVC1G32GS | ||
74LVC1G32GW | 935268381165 | |||||
74LVC1G32GW | 935268381115 | |||||
74LVC1G32GW | 935268381118 | |||||
74LVC1G32GW/C4 | 935301947125 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74LVC1G32GM | 74LVC1G32GM,132 | 74LVC1G32GM | Always Pb-free | ||
74LVC1G32GM | 74LVC1G32GM,115 | 74LVC1G32GM | Always Pb-free | ||
74LVC1G32GN | 74LVC1G32GN,132 | 74LVC1G32GN | Always Pb-free | ||
74LVC1G32GS | 74LVC1G32GS,132 | 74LVC1G32GS | Always Pb-free | ||
74LVC1G32GV | 74LVC1G32GV,125 | 74LVC1G32GV | week 36, 2003 | ||
74LVC1G32GW | 74LVC1G32GW,125 | 74LVC1G32GW | week 36, 2003 | ||
74LVC1G32GX | 74LVC1G32GX,125 | 74LVC1G32GX | Always Pb-free |
文档 (25)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC1G32 | Single 2-input OR gate | Data sheet | 2023-08-18 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc1g32 | 74LVC1G32 IBIS model | IBIS model | 2014-10-20 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
样品
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