特性
-
Wide supply voltage range from 2.0 V to 6.0 V
-
CMOS low power dissipation
-
High noise immunity
-
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
-
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
-
Input levels:
-
For 74HC27: CMOS level
-
For 74HCT27: TTL level
-
-
ESD protection:
-
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
-
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
-
-
Multiple package options
-
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC27BQ | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 8.0 | 36 | 3 | low | -40~125 | 107 | 21.7 | 75 | DHVQFN14 |
| 74HC27D | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 8.0 | 36 | 3 | low | -40~125 | 109 | 20.9 | 68 | SO14 |
| 74HC27PW | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 8.0 | 36 | 3 | low | -40~125 | 142 | 8.1 | 68 | TSSOP14 |
| 74HCT27BQ | Production | 4.5 - 5.5 | TTL | ± 4 | 10 | 36 | 3 | low | -40~125 | 107 | 21.7 | 75 | DHVQFN14 |
| 74HCT27D | Production | 4.5 - 5.5 | TTL | ± 4 | 10 | 36 | 3 | low | -40~125 | 109 | 20.9 | 68 | SO14 |
| 74HCT27PW | Production | 4.5 - 5.5 | TTL | ± 4 | 10 | 36 | 3 | low | -40~125 | 142 | 8.1 | 68 | TSSOP14 |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| 74HC27BQ |  DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | HC27 | 74HC27BQ,115 ( 9352 836 78115 ) | |
| 74HC27D |  SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_653 | Active | 74HC27D | 74HC27D,653 ( 9337 141 70653 ) |
| 74HC27PW |  TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | HC27 | 74HC27PW,118 ( 9351 890 10118 ) |
| 74HCT27BQ | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | HCT27 | 74HCT27BQ,115 ( 9352 836 79115 ) | |
| 74HCT27D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_653 | Active | 74HCT27D | 74HCT27D,653 ( 9337 141 80653 ) |
| 74HCT27PW | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | HCT27 | 74HCT27PW,118 ( 9351 895 80118 ) |
下表中的版本已停产。参见表 停产信息 了解更多信息。
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| 74HCT27D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_652 | Withdrawn / End-of-life | 74HCT27D | 74HCT27D,652 ( 9337 141 80652 ) |
| 74HCT27PW | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_112 | Withdrawn / End-of-life | HCT27 | 74HCT27PW,112 ( 9351 895 80112 ) |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| 74HC27BQ | 74HC27BQ,115 | 74HC27BQ |  |   | Always Pb-free |
| 74HC27D | 74HC27D,653 | 74HC27D | | | week 5, 2004 |
| 74HC27PW | 74HC27PW,118 | 74HC27PW | | | week 10, 2005 |
| 74HCT27BQ | 74HCT27BQ,115 | 74HCT27BQ | | | Always Pb-free |
| 74HCT27D | 74HCT27D,653 | 74HCT27D | | | week 5, 2004 |
| 74HCT27PW | 74HCT27PW,118 | 74HCT27PW | | | week 10, 2005 |
下表中的版本已停产。参见表 停产信息 了解更多信息。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| 74HCT27D | 74HCT27D,652 | 74HCT27D | | | week 5, 2004 |
| 74HCT27PW | 74HCT27PW,112 | 74HCT27PW | | | week 10, 2005 |
文档 (10)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74HC_HCT27 | Triple 3-input NOR gate | Data sheet | 2024-03-25 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。