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74LVC1G38

2-input NAND gate; open drain

The 74LVC1G38 is a single 2-input NAND gate with open-drain output. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • 5 V tolerant outputs for interfacing with 5 V logic

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power consumption

  • Open drain outputs

  • Direct interface with TTL levels

  • Inputs accept voltages up to 5 V

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V).

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +125 °C.

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G38GMProduction1.65 - 5.5CMOS/LVTTL322.31751low-40~1253137.8158XSON6
74LVC1G38GNProduction1.65 - 5.5CMOS/LVTTL322.31751low-40~12533823.5210XSON6
74LVC1G38GSProduction1.65 - 5.5CMOS/LVTTL322.31751low-40~12532529.9218XSON6
74LVC1G38GVProduction1.65 - 5.5CMOS/LVTTL322.31751low-40~12527063.3169TSOP5
74LVC1G38GWProduction1.65 - 5.5CMOS/LVTTL322.31751low-40~12531180.9181TSSOP5
74LVC1G38GXProduction1.65 - 5.5CMOS/LVTTL322.31751low-40~12532794.5195X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G38GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveYB74LVC1G38GM,132
( 9352 771 94132 )
SOT886_115ActiveYB74LVC1G38GM,115
( 9352 771 94115 )
74LVC1G38GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveYB74LVC1G38GN,132
( 9352 917 87132 )
74LVC1G38GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveYB74LVC1G38GS,132
( 9352 929 15132 )
74LVC1G38GV
TSOP5
(SOT753) 		SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActiveYB74LVC1G38GV,125
( 9352 766 62125 )
74LVC1G38GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveYB74LVC1G38GW,125
( 9352 766 61125 )
74LVC1G38GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActiveYB74LVC1G38GX,125
( 9352 983 82125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G38GM74LVC1G38GM,13274LVC1G38GMAlways Pb-free
74LVC1G38GM74LVC1G38GM,11574LVC1G38GMAlways Pb-free
74LVC1G38GN74LVC1G38GN,13274LVC1G38GNAlways Pb-free
74LVC1G38GS74LVC1G38GS,13274LVC1G38GSAlways Pb-free
74LVC1G38GV74LVC1G38GV,12574LVC1G38GVweek 36, 2003
74LVC1G38GW74LVC1G38GW,12574LVC1G38GWweek 36, 2003
74LVC1G38GX74LVC1G38GX,12574LVC1G38GXAlways Pb-free
品质及可靠性免责声明

文档 (20)

文件名称标题类型日期
74LVC1G382-input NAND gate; open drainData sheet2023-08-18
lvc1g3874LVC1G38 IBIS modelIBIS model2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
lvc1g3874LVC1G38 IBIS modelIBIS model2014-10-20

样品

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