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74LVC1G00

Single 2-input NAND gate

The 74LVC1G00 is a single 2-input NAND gate. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • CMOS low power dissipation

  • IOFF circuitry provides partial Power-down mode operation

  • ±24 mA output drive (VCC = 3.0 V)

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G00GMProduction1.65 - 5.5CMOS/LVTTL± 322.21751low-40~1253137.8158XSON6
74LVC1G00GNProduction1.65 - 5.5CMOS/LVTTL± 322.21751low-40~12533823.5210XSON6
74LVC1G00GSProduction1.65 - 5.5CMOS/LVTTL± 322.21751low-40~12532529.9218XSON6
74LVC1G00GVProduction1.65 - 5.5CMOS/LVTTL± 322.21751low-40~12527063.3169TSOP5
74LVC1G00GWProduction1.65 - 5.5CMOS/LVTTL± 322.21751low-40~12531180.9181TSSOP5
74LVC1G00GXProduction1.65 - 5.5CMOS/LVTTL± 322.21751low-40~12532794.5195X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G00GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_115ActiveVA74LVC1G00GM,115
( 9352 771 86115 )
SOT886_132ActiveVA74LVC1G00GM,132
( 9352 771 86132 )
74LVC1G00GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveVA74LVC1G00GN,132
( 9352 917 68132 )
74LVC1G00GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveVA74LVC1G00GS,132
( 9352 924 48132 )
74LVC1G00GV
TSOP5
(SOT753) 		SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActiveV0074LVC1G00GV,125
( 9352 720 27125 )
74LVC1G00GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveVA74LVC1G00GW,125
( 9352 683 78125 )
74LVC1G00GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActiveVA74LVC1G00GX,125
( 9352 983 74125 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC1G00GM935277186125
74LVC1G00GW935268378165
74LVC1G00GW935268378115
74LVC1G00GW935268378118

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G00GM74LVC1G00GM,11574LVC1G00GMAlways Pb-free
74LVC1G00GM74LVC1G00GM,13274LVC1G00GMAlways Pb-free
74LVC1G00GN74LVC1G00GN,13274LVC1G00GNAlways Pb-free
74LVC1G00GS74LVC1G00GS,13274LVC1G00GSAlways Pb-free
74LVC1G00GV74LVC1G00GV,12574LVC1G00GVweek 36, 2003
74LVC1G00GW74LVC1G00GW,12574LVC1G00GWweek 36, 2003
74LVC1G00GX74LVC1G00GX,12574LVC1G00GXAlways Pb-free
品质及可靠性免责声明

文档 (22)

文件名称标题类型日期
74LVC1G00Single 2-input NAND gateData sheet2023-08-04
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g0074LVC1G00 IBIS modelIBIS model2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

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模型

文件名称标题类型日期
lvc1g0074LVC1G00 IBIS modelIBIS model2014-10-20

样品

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