特性
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Wide supply voltage range from 2.0 V to 6.0 V
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CMOS low power dissipation
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Input levels:
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For 74HC1G00: CMOS level
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For 74HCT1G00: TTL level
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Symmetrical output impedance
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High noise immunity
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Latch-up performance exceeds 100 mA per JESD78 Class II Level B
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Balanced propagation delays
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Complies with JEDEC standards:
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JESD8C (2.7 V to 3.6 V)
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JESD7A (2.0 V to 6.0 V)
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ESD protection:
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HBM JESD22-A114E exceeds 2000 V
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MM JESD22-A115-A exceeds 200 V
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC1G00GV | Production | 2.0 - 6.0 | CMOS | ± 2.6 | 7.0 | 36 | 1 | low | -40~125 | 220 | 33.0 | 131 | TSOP5 |
| 74HC1G00GW | Production | 2.0 - 6.0 | CMOS | ± 2.6 | 7.0 | 36 | 1 | low | -40~125 | 261 | 39.3 | 138 | TSSOP5 |
| 74HCT1G00GV | Production | 4.5 - 5.5 | TTL | ± 2 | 10 | 36 | 1 | low | -40~125 | 220 | 33.0 | 131 | TSOP5 |
| 74HCT1G00GW | Production | 4.5 - 5.5 | TTL | ± 2 | 10 | 36 | 1 | low | -40~125 | 261 | 39.3 | 138 | TSSOP5 |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| 74HC1G00GV |  TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | H00 | 74HC1G00GV,125 ( 9352 720 10125 ) |
| 74HC1G00GW |  TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | HA | 74HC1G00GW,125 ( 9352 456 10125 ) |
| 74HCT1G00GV | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | T00 | 74HCT1G00GV,125 ( 9352 720 12125 ) |
| 74HCT1G00GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | TA | 74HCT1G00GW,125 ( 9352 456 00125 ) |
停产信息
| 型号 | 可订购的器件编号，（订购码(12NC)） | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
|---|---|---|---|---|---|---|
| 74HC1G00GW | 935245610165 | |||||
| 74HC1G00GW | 935245610115 | |||||
| 74HC1G00GW | 935245610118 | |||||
| 74HCT1G00GW | 935245600165 | |||||
| 74HCT1G00GW | 935245600115 | |||||
| 74HCT1G00GW | 935245600118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| 74HC1G00GV | 74HC1G00GV,125 | 74HC1G00GV |  |   | week 36, 2003 |
| 74HC1G00GW | 74HC1G00GW,125 | 74HC1G00GW | | | week 36, 2003 |
| 74HCT1G00GV | 74HCT1G00GV,125 | 74HCT1G00GV | | | week 36, 2003 |
| 74HCT1G00GW | 74HCT1G00GW,125 | 74HCT1G00GW | | | week 36, 2003 |
文档 (10)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74HC_HCT1G00 | 2-input NAND gate | Data sheet | 2022-01-21 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| hc1g00 | 74HC1G00 IBIS model | IBIS model | 2022-05-25 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
样品
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