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74AUP1G38

Low-power 2-input NAND gate (open drain)

The 74AUP1G38 is a single 2-input NAND gate with open-drain output. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G38GMProduction0.8 - 3.6CMOS1.98.5701ultra low-40~1253117.7157XSON6
74AUP1G38GNProduction0.8 - 3.6CMOS1.98.5701ultra low-40~12533422.6207XSON6
74AUP1G38GSProduction0.8 - 3.6CMOS1.98.5701ultra low-40~12532128.7215XSON6
74AUP1G38GWProduction0.8 - 3.6CMOS1.98.5701ultra low-40~12530979.2179TSSOP5
74AUP1G38GXProduction0.8 - 3.6CMOS1.98.5701ultra low-40~12532290.7191X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G38GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveaB74AUP1G38GM,132
( 9352 790 32132 )
SOT886_115ActiveaB74AUP1G38GM,115
( 9352 790 32115 )
74AUP1G38GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveaB74AUP1G38GN,132
( 9352 917 42132 )
74AUP1G38GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveaB74AUP1G38GS,132
( 9352 928 66132 )
74AUP1G38GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveaB74AUP1G38GW,125
( 9352 790 31125 )
74AUP1G38GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActiveaB74AUP1G38GX,125
( 9352 983 64125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G38GM74AUP1G38GM,13274AUP1G38GMAlways Pb-free
74AUP1G38GM74AUP1G38GM,11574AUP1G38GMAlways Pb-free
74AUP1G38GN74AUP1G38GN,13274AUP1G38GNAlways Pb-free
74AUP1G38GS74AUP1G38GS,13274AUP1G38GSAlways Pb-free
74AUP1G38GW74AUP1G38GW,12574AUP1G38GWAlways Pb-free
74AUP1G38GX74AUP1G38GX,12574AUP1G38GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP1G38Low-power 2-input NAND gate (open drain)Data sheet2023-07-18
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g3874AUP1G38 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

支持

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模型

文件名称标题类型日期
aup1g3874AUP1G38 IBIS modelIBIS model2014-12-14

样品

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