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    74AUP1G132

    Low-power 2-input NAND Schmitt trigger

    The 74AUP1G132 is a single 2-input NAND gate with Schmitt-trigger inputs. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • CMOS low power dissipation

    • High noise immunity

    • Overvoltage tolerant inputs to 3.6 V

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Latch-up performance exceeds 100 mA per JESD 78 Class II

    • Low noise overshoot and undershoot < 10 % of VCC

    • IOFF circuitry provides partial Power-down mode operation

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)
      • JESD8-11 (0.9 V to 1.65 V)
      • JESD8-7 (1.65 V to 1.95 V)
      • JESD8-5 (2.3 V to 2.7 V)
      • JESD8C (2.7 V to 3.6 V )

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    目标应用

    • Wave and pulse shaper

    • Astable multivibrator

    • Monostable multivibrator.

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74AUP1G132GMProduction0.8 - 3.6CMOS± 1.910701ultra low-40~1253117.7157XSON6
    74AUP1G132GNProduction0.8 - 3.6CMOS± 1.910701ultra low-40~12533422.6207XSON6
    74AUP1G132GSProduction0.8 - 3.6CMOS± 1.910701ultra low-40~12532128.7215XSON6
    74AUP1G132GWProduction0.8 - 3.6CMOS± 1.910701ultra low-40~12530979.2179TSSOP5
    74AUP1G132GXProduction0.8 - 3.6CMOS± 1.910701ultra low-40~12532290.7191X2SON5

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74AUP1G132GM
    XSON6
    (SOT886)     		SOT886REFLOW_BG-BD-1
    		SOT886_132ActiveaE74AUP1G132GM,132
    ( 9352 790 59132 )
    SOT886_115ActiveaE74AUP1G132GM,115
    ( 9352 790 59115 )
    74AUP1G132GN
    XSON6
    (SOT1115)     		SOT1115REFLOW_BG-BD-1
    		SOT1115_132ActiveaE74AUP1G132GN,132
    ( 9352 917 24132 )
    74AUP1G132GS
    XSON6
    (SOT1202)     		SOT1202REFLOW_BG-BD-1
    		SOT1202_132ActiveaE74AUP1G132GS,132
    ( 9352 928 48132 )
    74AUP1G132GW
    TSSOP5
    (SOT353-1)     		SOT353-1WAVE_BG-BD-1
    		SOT353-1_125ActiveaE74AUP1G132GW,125
    ( 9352 790 58125 )
    74AUP1G132GX
    X2SON5
    (SOT1226-3)     		SOT1226-3SOT1226-3_125ActiveaE74AUP1G132GX,125
    ( 9352 983 71125 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP1G132GM74AUP1G132GM,13274AUP1G132GMAlways Pb-free
    74AUP1G132GM74AUP1G132GM,11574AUP1G132GMAlways Pb-free
    74AUP1G132GN74AUP1G132GN,13274AUP1G132GNAlways Pb-free
    74AUP1G132GS74AUP1G132GS,13274AUP1G132GSAlways Pb-free
    74AUP1G132GW74AUP1G132GW,12574AUP1G132GWAlways Pb-free
    74AUP1G132GX74AUP1G132GX,12574AUP1G132GXAlways Pb-free
    品质及可靠性免责声明

    文档 (17)

    文件名称标题类型日期
    74AUP1G132Low-power 2-input NAND Schmitt triggerData sheet2023-07-11
    aup1g132aup1g132 IBIS modelIBIS model2013-04-07
    Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

    支持

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    模型

    文件名称标题类型日期
    aup1g132aup1g132 IBIS modelIBIS model2013-04-07

    样品

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