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    74AUP1G86

    Low-power 2-input EXCLUSIVE-OR gate

    The 74AUP1G86 is a single 2-input EXCLUSIVE-OR gate. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • CMOS low power dissipation

    • High noise immunity

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Overvoltage tolerant inputs to 3.6 V

    • Low noise overshoot and undershoot < 10 % of VCC

    • IOFF circuitry provides partial power-down mode operation

    • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)

      • JESD8-11 (0.9 V to 1.65 V)

      • JESD8-7 (1.2 V to 1.95 V)

      • JESD8-5 (1.8 V to 2.7 V)

      • JESD8-B (2.7 V to 3.6 V)

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74AUP1G86GMProduction0.8 - 3.6CMOS± 1.99.0701ultra low-40~1253117.7157XSON6
    74AUP1G86GNProduction0.8 - 3.6CMOS± 1.99.0701ultra low-40~12533422.6207XSON6
    74AUP1G86GSProduction0.8 - 3.6CMOS± 1.99.0701ultra low-40~12532128.7215XSON6
    74AUP1G86GWProduction0.8 - 3.6CMOS± 1.99.0701ultra low-40~12530979.2179TSSOP5
    74AUP1G86GXProduction0.8 - 3.6CMOS± 1.99.0701ultra low-40~12532290.7191X2SON5

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74AUP1G86GM
    XSON6
    (SOT886)     		SOT886REFLOW_BG-BD-1
    		SOT886_132ActivepH74AUP1G86GM,132
    ( 9352 790 53132 )
    SOT886_115ActivepH74AUP1G86GM,115
    ( 9352 790 53115 )
    74AUP1G86GN
    XSON6
    (SOT1115)     		SOT1115REFLOW_BG-BD-1
    		SOT1115_132ActivepH74AUP1G86GN,132
    ( 9352 917 47132 )
    74AUP1G86GS
    XSON6
    (SOT1202)     		SOT1202REFLOW_BG-BD-1
    		SOT1202_132ActivepH74AUP1G86GS,132
    ( 9352 928 72132 )
    74AUP1G86GW
    TSSOP5
    (SOT353-1)     		SOT353-1WAVE_BG-BD-1
    		SOT353-1_125ActivepH74AUP1G86GW,125
    ( 9352 790 52125 )
    74AUP1G86GX
    X2SON5
    (SOT1226-3)     		SOT1226-3SOT1226-3_125ActivepH74AUP1G86GX,125
    ( 9352 983 67125 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP1G86GM74AUP1G86GM,13274AUP1G86GMAlways Pb-free
    74AUP1G86GM74AUP1G86GM,11574AUP1G86GMAlways Pb-free
    74AUP1G86GN74AUP1G86GN,13274AUP1G86GNAlways Pb-free
    74AUP1G86GS74AUP1G86GS,13274AUP1G86GSAlways Pb-free
    74AUP1G86GW74AUP1G86GW,12574AUP1G86GWAlways Pb-free
    74AUP1G86GX74AUP1G86GX,12574AUP1G86GXAlways Pb-free
    品质及可靠性免责声明

    文档 (19)

    文件名称标题类型日期
    74AUP1G86Low-power 2-input EXCLUSIVE-OR gateData sheet2023-07-14
    AN10161PicoGate Logic footprintsApplication note2002-10-29
    AN11052Pin FMEA for AUP familyApplication note2019-01-09
    aup1g8674AUP1G86 IBIS modelIBIS model2014-12-14
    Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

    支持

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    模型

    文件名称标题类型日期
    aup1g8674AUP1G86 IBIS modelIBIS model2014-12-14

    样品

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