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74LVC1G97

Low-power configurable multiple function gate

The 74LVC1G97 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions MUX, AND, OR, NAND, NOR, inverter and buffer; using the 3-bit input. All inputs can be connected to VCC or GND.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • 5 V tolerant input/output for interfacing with 5 V logic

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8B/JESD36 (2.7 V to 3.6 V).

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Inputs accept voltages up to 5 V

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C.

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G97GMProduction1.65 - 5.5TTL± 326.31501low-40~1253087.5155XSON6
74LVC1G97GNProduction1.65 - 5.5TTL± 326.31501low-40~12532521.0201XSON6
74LVC1G97GSProduction1.65 - 5.5TTL± 326.31501low-40~12531326.6209XSON6
74LVC1G97GVProduction1.65 - 5.5TTL± 326.31501low-40~12523743.9150TSOP6
74LVC1G97GWProduction1.65 - 5.5TTL± 326.31501low-40~12527750.1165TSSOP6
74LVC1G97GXProduction1.65 - 5.5TTL± 326.31501low-40~125---X2SON6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G97GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveYV74LVC1G97GM,132
( 9352 931 86132 )
74LVC1G97GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveYV74LVC1G97GN,132
( 9352 931 87132 )
74LVC1G97GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveYV74LVC1G97GS,132
( 9352 931 88132 )
74LVC1G97GV
TSOP6
(SOT457) 		SOT457REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125ActiveY9774LVC1G97GV,125
( 9352 931 89125 )
74LVC1G97GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveYV74LVC1G97GW,125
( 9352 931 91125 )
74LVC1G97GX
X2SON6
(SOT1255-2) 		SOT1255-2SOT1255-2_147ActiveYV74LVC1G97GXZ
( 9353 389 83147 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G97GM74LVC1G97GM,13274LVC1G97GMAlways Pb-free
74LVC1G97GN74LVC1G97GN,13274LVC1G97GNAlways Pb-free
74LVC1G97GS74LVC1G97GS,13274LVC1G97GSAlways Pb-free
74LVC1G97GV74LVC1G97GV,12574LVC1G97GVAlways Pb-free
74LVC1G97GW74LVC1G97GW,12574LVC1G97GWAlways Pb-free
74LVC1G97GX74LVC1G97GXZ74LVC1G97GXweek 25, 2019
品质及可靠性免责声明

文档 (21)

文件名称标题类型日期
74LVC1G97Low-power configurable multiple function gateData sheet2023-08-28
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g9774LVC1G97 IBIS modelIBIS model2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812Single configurable logicLeaflet2019-01-04
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
SOT1255-2plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mmPackage information2020-08-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
lvc1g9774LVC1G97 IBIS modelIBIS model2014-10-20

样品

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