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    74LVC1G57

    Low-power configurable multiple function gate

    The 74LVC1G57 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to VCC or GND. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

    This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 1.65 V to 5.5 V

    • Overvoltage tolerant inputs to 5.5 V

    • High noise immunity

    • ±24 mA output drive (VCC = 3.0 V)

    • CMOS low power dissipation

    • Latch-up performance exceeds 250 mA

    • Direct interface with TTL levels

    • IOFF circuitry provides partial Power-down mode operation

    • Complies with JEDEC standard:

      • JESD8-7 (1.65 V to 1.95 V)

      • JESD8-5 (2.3 V to 2.7 V)

      • JESD8B/JESD36 (2.7 V to 3.6 V).

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C.

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74LVC1G57GMProduction1.65 - 5.5TTL± 326.31501low-40~1253087.5155XSON6
    74LVC1G57GNProduction1.65 - 5.5TTL± 326.31501low-40~12532521.0201XSON6
    74LVC1G57GSProduction1.65 - 5.5TTL± 326.31501low-40~12531326.6209XSON6
    74LVC1G57GVProduction1.65 - 5.5TTL± 326.31501low-40~12525054.7163TSOP6
    74LVC1G57GWProduction1.65 - 5.5TTL± 326.31501low-40~12527750.1165TSSOP6

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74LVC1G57GM
    XSON6
    (SOT886)     		SOT886REFLOW_BG-BD-1
    		SOT886_132ActiveYC74LVC1G57GM,132
    ( 9352 772 11132 )
    SOT886_115ActiveYC74LVC1G57GM,115
    ( 9352 772 11115 )
    74LVC1G57GN
    XSON6
    (SOT1115)     		SOT1115REFLOW_BG-BD-1
    		SOT1115_132ActiveYC74LVC1G57GN,132
    ( 9352 917 88132 )
    74LVC1G57GS
    XSON6
    (SOT1202)     		SOT1202REFLOW_BG-BD-1
    		SOT1202_132ActiveYC74LVC1G57GS,132
    ( 9352 929 16132 )
    74LVC1G57GV
    TSOP6
    (SOT457)     		SOT457REFLOW_BG-BD-1
    WAVE_BG-BD-1
    		SOT457_125ActiveV5774LVC1G57GV,125
    ( 9352 760 73125 )
    74LVC1G57GW
    TSSOP6
    (SOT363-2)     		SOT363-2SOT363-2_125ActiveYC74LVC1G57GW,125
    ( 9352 760 71125 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74LVC1G57GM74LVC1G57GM,13274LVC1G57GMAlways Pb-free
    74LVC1G57GM74LVC1G57GM,11574LVC1G57GMAlways Pb-free
    74LVC1G57GN74LVC1G57GN,13274LVC1G57GNAlways Pb-free
    74LVC1G57GS74LVC1G57GS,13274LVC1G57GSAlways Pb-free
    74LVC1G57GV74LVC1G57GV,12574LVC1G57GVAlways Pb-free
    74LVC1G57GW74LVC1G57GW,12574LVC1G57GWAlways Pb-free
    品质及可靠性免责声明

    文档 (20)

    文件名称标题类型日期
    74LVC1G57Low-power configurable multiple function gateData sheet2023-08-18
    AN10161PicoGate Logic footprintsApplication note2002-10-29
    AN11009Pin FMEA for LVC familyApplication note2019-01-09
    lvc1g5774LVC1G57 IBIS modelIBIS model2014-10-20
    Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812Single configurable logicLeaflet2019-01-04
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    lvc1g5774LVC1G57 IBIS modelIBIS model2014-10-20

    样品

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