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74AUP1T97

Low-power configurable gate with voltage-level translator

The 74AUP1T97 is a configurable multiple function gate with level translating, Schmitt-trigger inputs. The device can be configured as any of the following logic functions MUX, AND, OR, NAND, NOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to VCC or GND. Low threshold Schmitt trigger inputs allow these devices to be driven by 1.8 V logic levels in 3.3 V applications. This device ensures very low static and dynamic power consumption across the entire VCC range from 2.3 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 2.3 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Low static power consumption; ICC = 1.5 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1T97GF
NRND 		Not for design in-----------XSON6
74AUP1T97GMProduction2.3 - 3.6CMOS± 1.98.7701ultra low-40~1252906.5145XSON6
74AUP1T97GNProduction2.3 - 3.6CMOS± 1.98.7701ultra low-40~12527511.7171XSON6
74AUP1T97GSProduction2.3 - 3.6CMOS± 1.98.7701ultra low-40~12527214.8177XSON6
74AUP1T97GWProduction2.3 - 3.6CMOS± 1.98.7701ultra low-40~12526438.6153TSSOP6
74AUP1T97GXProduction2.3 - 3.6CMOS± 1.98.7701ultra low-40~12531685.8186X2SON6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1T97GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132Active5974AUP1T97GM,132
( 9352 804 69132 )
SOT886_115Active5974AUP1T97GM,115
( 9352 804 69115 )
74AUP1T97GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132Active5974AUP1T97GN,132
( 9352 889 86132 )
74AUP1T97GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132Active5974AUP1T97GS,132
( 9352 928 81132 )
74AUP1T97GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125Active5974AUP1T97GW,125
( 9352 804 68125 )
74AUP1T97GX
X2SON6
(SOT1255-2) 		SOT1255-2SOT1255-2_147Active5974AUP1T97GXZ
( 9353 070 73147 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74AUP1T97GF9352813661322021-06-302021-12-3174AUP1T97GS
    74AUP1T97GX935307073125

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP1T97GM74AUP1T97GM,13274AUP1T97GMAlways Pb-free
    74AUP1T97GM74AUP1T97GM,11574AUP1T97GMAlways Pb-free
    74AUP1T97GN74AUP1T97GN,13274AUP1T97GNAlways Pb-free
    74AUP1T97GS74AUP1T97GS,13274AUP1T97GSAlways Pb-free
    74AUP1T97GW74AUP1T97GW,12574AUP1T97GWAlways Pb-free
    74AUP1T97GX74AUP1T97GXZ74AUP1T97GXAlways Pb-free
    品质及可靠性免责声明

    文档 (18)

    文件名称标题类型日期
    Nexperia_document_guide_Logic_translatorsNexperia Logic TranslatorsBrochure2021-04-12
    Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
    SOT1255-2plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mmPackage information2020-08-27
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    SOT891plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm bodyPackage information2020-04-21
    MAR_SOT891MAR_SOT891 TopmarkTop marking2013-06-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

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