特性
-
Wide supply voltage range from 2.3 V to 3.6 V
-
High noise immunity
-
Low static power consumption; ICC = 1.5 μA (maximum)
-
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
-
Overvoltage tolerant inputs to 3.6 V
-
Low noise overshoot and undershoot < 10 % of VCC
-
IOFF circuitry provides partial power-down mode operation
-
ESD protection:
-
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
-
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
-
-
Multiple package options
-
Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AUP1T57GM | Production | 2.3 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | 290 | 6.5 | 145 | XSON6 |
74AUP1T57GN | Production | 2.3 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | 275 | 11.7 | 171 | XSON6 |
74AUP1T57GS | Production | 2.3 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | 272 | 14.8 | 177 | XSON6 |
74AUP1T57GW | Production | 2.3 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74AUP1T57GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | a7 | 74AUP1T57GM,132 ( 9352 804 65132 ) |
SOT886_115 | Active | a7 | 74AUP1T57GM,115 ( 9352 804 65115 ) | ||||
74AUP1T57GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | a7 | 74AUP1T57GN,132 ( 9352 917 54132 ) |
74AUP1T57GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | a7 | 74AUP1T57GS,132 ( 9352 928 78132 ) |
74AUP1T57GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | a7 | 74AUP1T57GW,125 ( 9352 804 64125 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74AUP1T57GM | 74AUP1T57GM,132 | 74AUP1T57GM | Always Pb-free | ||
74AUP1T57GM | 74AUP1T57GM,115 | 74AUP1T57GM | Always Pb-free | ||
74AUP1T57GN | 74AUP1T57GN,132 | 74AUP1T57GN | Always Pb-free | ||
74AUP1T57GS | 74AUP1T57GS,132 | 74AUP1T57GS | Always Pb-free | ||
74AUP1T57GW | 74AUP1T57GW,125 | 74AUP1T57GW | Always Pb-free |
文档 (15)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AUP1T57 | Low-power configurable gate with voltage-level translator | Data sheet | 2023-07-26 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
aup1t57 | aup1t57 IBIS model | IBIS model | 2014-12-21 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
样品
安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.
样品订单通常需要2-4天寄送时间。
如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品