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74AUP2G08

Low-power dual 2-input AND gate

The 74AUP2G08 is a dual 2-input AND gate. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • CMOS low power dissipation

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD78 Class II

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP2G08DCProduction0.8 - 3.6CMOS± 1.98.2702ultra low-40~12520334.1113VSSOP8
74AUP2G08GNProduction0.8 - 3.6CMOS± 1.98.2702ultra low-40~12523810.6148XSON8
74AUP2G08GSProduction0.8 - 3.6CMOS± 1.98.2702ultra low-40~12527610.8146XSON8
74AUP2G08GTProduction0.8 - 3.6CMOS± 1.98.2702ultra low-40~1253276.1157XSON8
74AUP2G08GXProduction0.8 - 3.6CMOS± 1.98.2702ultra low-40~125---X2SON8

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP2G08DC
VSSOP8
(SOT765-1) 		SOT765-1SOT765-1_125Activep0874AUP2G08DC,125
( 9352 807 11125 )
74AUP2G08GN
XSON8
(SOT1116) 		SOT1116REFLOW_BG-BD-1
SOT1116_115ActivepE74AUP2G08GN,115
( 9352 922 19115 )
74AUP2G08GS
XSON8
(SOT1203) 		SOT1203REFLOW_BG-BD-1
SOT1203_115ActivepE74AUP2G08GS,115
( 9352 927 81115 )
74AUP2G08GT
XSON8
(SOT833-1) 		SOT833-1SOT833-1_115Activep0874AUP2G08GT,115
( 9352 807 12115 )
74AUP2G08GX
X2SON8
(SOT1233-2) 		SOT1233-2SOT1233-2_115ActivepE74AUP2G08GXX
( 9353 084 33115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP2G08DC74AUP2G08DC,12574AUP2G08DCAlways Pb-free
74AUP2G08GN74AUP2G08GN,11574AUP2G08GNAlways Pb-free
74AUP2G08GS74AUP2G08GS,11574AUP2G08GSAlways Pb-free
74AUP2G08GT74AUP2G08GT,11574AUP2G08GTAlways Pb-free
74AUP2G08GX74AUP2G08GXX74AUP2G08GXweek 25, 2019
品质及可靠性免责声明

文档 (17)

文件名称标题类型日期
74AUP2G08Low-power dual 2-input AND gateData sheet2023-07-19
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup2g08aup2g08 IBIS modelIBIS model2013-04-07
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
SOT1233-2plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mmPackage information2022-04-21
MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup2g08aup2g08 IBIS modelIBIS model2013-04-07

样品

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