特性
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Wide supply voltage range from 2.0 V to 6.0 V
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CMOS low power dissipation
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High noise immunity
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
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Input levels:
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For 74HC157: CMOS level
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For 74HCT157: TTL level
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Non-inverting data path
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74HC157BQ | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 92 | 13.1 | 61 | DHVQFN16 |
74HC157D | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 92 | 9.2 | 51 | SO16 |
74HC157PW | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 124 | 4.4 | 53.6 | TSSOP16 |
74HCT157BQ | Production | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | 92 | 13.1 | 61 | DHVQFN16 |
74HCT157D | Production | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | 92 | 9.2 | 51 | SO16 |
74HCT157PW | Production | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | 124 | 4.4 | 53.6 | TSSOP16 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74HC157BQ | DHVQFN16 (SOT763-1) | SOT763-1 | SOT763-1_115 | Active | HC157 | 74HC157BQ,115 ( 9352 944 23115 ) | |
74HC157D | SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_653 | Active | 74HC157D | 74HC157D,653 ( 9337 137 40653 ) |
74HC157PW | TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | Active | HC157 | 74HC157PW,118 ( 9351 868 80118 ) |
74HCT157BQ | DHVQFN16 (SOT763-1) | SOT763-1 | SOT763-1_115 | Active | HCT157 | 74HCT157BQ,115 ( 9352 944 24115 ) | |
74HCT157D | SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_653 | Active | 74HCT157D | 74HCT157D,653 ( 9337 137 50653 ) |
74HCT157PW | TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | Active | HCT157 | 74HCT157PW,118 ( 9351 885 40118 ) |
下表中的版本已停产。参见表 停产信息 了解更多信息。
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74HC157D | SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_652 | Withdrawn / End-of-life | 74HC157D | 74HC157D,652 ( 9337 137 40652 ) |
74HC157PW | TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_112 | Withdrawn / End-of-life | HC157 | 74HC157PW,112 ( 9351 868 80112 ) |
74HCT157D | SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_652 | Withdrawn / End-of-life | 74HCT157D | 74HCT157D,652 ( 9337 137 50652 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
74HC157D | 933713740652 | 2021-12-31 | 2022-06-30 | 74HC157D | ||
74HC157PW | 935186880112 | 2021-12-31 | 2022-06-30 | 74HC157PW | ||
74HCT157D | 933713750652 | 2021-12-31 | 2022-06-30 | 74HCT157D | ||
74HCT157PW | 935188540112 | 2021-12-31 | 2022-06-30 | 74HCT157PW |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74HC157BQ | 74HC157BQ,115 | 74HC157BQ | Always Pb-free | ||
74HC157D | 74HC157D,653 | 74HC157D | week 35, 2004 | ||
74HC157PW | 74HC157PW,118 | 74HC157PW | week 10, 2005 | ||
74HCT157BQ | 74HCT157BQ,115 | 74HCT157BQ | Always Pb-free | ||
74HCT157D | 74HCT157D,653 | 74HCT157D | week 12, 2005 | ||
74HCT157PW | 74HCT157PW,118 | 74HCT157PW | week 10, 2005 |
下表中的版本已停产。参见表 停产信息 了解更多信息。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74HC157D | 74HC157D,652 | 74HC157D | week 35, 2004 | ||
74HC157PW | 74HC157PW,112 | 74HC157PW | week 10, 2005 | ||
74HCT157D | 74HCT157D,652 | 74HCT157D | week 12, 2005 |
文档 (12)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT157 | Quad 2-input multiplexer | Data sheet | 2024-05-28 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
hc157 | 74HC157 IBIS model | IBIS model | 2015-11-02 |
hct157 | 74HCT157 IBIS model | IBIS model | 2015-11-02 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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