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74AUP1G19

Low-power 1-of-2 decoder/demultiplexer

The 74AUP1G19 is a 1-to-2 decoder/demultiplexer with a common output enable. This device buffers the data on input A and passes it to the outputs 1Y (true) and 2Y (complement) when the enable (E) input signal is LOW. A HIGH E causes both outputs to assume a HIGH state.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Low static power consumption; ICC = 0.9 µA (maximum)

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G19GMProduction0.8 - 3.6CMOS1.9 / -1.93.0ultra low-40~1252906.5145XSON6
74AUP1G19GNProduction0.8 - 3.6CMOS1.9 / -1.93.0ultra low-40~12527511.7171XSON6
74AUP1G19GSProduction0.8 - 3.6CMOS1.9 / -1.93.0ultra low-40~12527214.8177XSON6
74AUP1G19GWProduction0.8 - 3.6CMOS1.9 / -1.93.0ultra low-40~12526438.6153TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G19GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActivepY74AUP1G19GM,132
( 9352 799 55132 )
SOT886_115ActivepY74AUP1G19GM,115
( 9352 799 55115 )
74AUP1G19GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepY74AUP1G19GN,132
( 9352 917 32132 )
74AUP1G19GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepY74AUP1G19GS,132
( 9352 928 56132 )
74AUP1G19GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActivepY74AUP1G19GW,125
( 9352 799 54125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G19GM74AUP1G19GM,13274AUP1G19GMAlways Pb-free
74AUP1G19GM74AUP1G19GM,11574AUP1G19GMAlways Pb-free
74AUP1G19GN74AUP1G19GN,13274AUP1G19GNAlways Pb-free
74AUP1G19GS74AUP1G19GS,13274AUP1G19GSAlways Pb-free
74AUP1G19GW74AUP1G19GW,12574AUP1G19GWAlways Pb-free
品质及可靠性免责声明

文档 (16)

文件名称标题类型日期
74AUP1G19Low-power 1-of-2 decoder/demultiplexerData sheet2023-07-17
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g19aup1g19 IBIS modelIBIS model2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup1g19aup1g19 IBIS modelIBIS model2014-12-21

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

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