特性
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Wide supply voltage range:
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VCC(A): 1.2 V to 3.6 V and VCC(B): 1.65 V to 5.5 V
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IOFF circuitry provides partial Power-down mode operation
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Inputs accept voltages up to 5.5 V
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port
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HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V
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Latch-up performance exceeds 100 mA per JESD 78B Class II
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Multiple package options
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Specified from −40 °C to +85 °C and −40 °C to +125 °C
参数类型
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXB0101GM | Production | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 1 | low | -40~125 | 232 | 3.3 | 110 | XSON6 |
NXB0101GS | Production | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 1 | low | -40~125 | - | - | - | XSON6 |
NXB0101GW | Production | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 1 | low | -40~125 | - | - | - | TSSOP6 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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NXB0101GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_115 | Active | n1 | NXB0101GMX ( 9352 897 26115 ) |
NXB0101GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_125 | Active | n1 | NXB0101GSH ( 9356 909 17125 ) |
NXB0101GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | n1 | NXB0101GWH ( 9352 897 28125 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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NXB0101GM | NXB0101GMX | NXB0101GM | |||
NXB0101GS | NXB0101GSH | NXB0101GS | |||
NXB0101GW | NXB0101GWH | NXB0101GW |
文档 (9)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
NXB0101 | Dual supply translating transceiver; auto direction sensing; 3-state | Data sheet | 2023-11-15 |
nxb0101 | NXB0101 IBIS model | IBIS model | 2020-02-26 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
样品
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