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    74LVC1G98

    Low-power configurable multiple function gate

    The 74LVC1G98 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions MUX, AND, OR, NAND, NOR, inverter and buffer; using the 3-bit input. All inputs can be connected to VCC or GND.

    Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

    This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 1.65 V to 5.5 V

    • 5 V tolerant input/output for interfacing with 5 V logic

    • High noise immunity

    • ±24 mA output drive (VCC = 3.0 V)

    • CMOS low power dissipation

    • IOFF circuitry provides partial Power-down mode operation

    • Direct interface with TTL levels

    • Inputs accept voltages up to 5 V

    • Latch-up performance exceeds 250 mA

    • Complies with JEDEC standard:

      • JESD8-7 (1.65 V to 1.95 V)

      • JESD8-5 (2.3 V to 2.7 V)

      • JESD8C (2.7 V to 3.6 V)

      • JESD36 (4.5 V to 5.5 V)

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C.

    参数类型

    Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74LVC1G98GMProductionn.a.n.a.TTL± 326.31501low-40~1253087.5155XSON6
    74LVC1G98GNProductionn.a.n.a.TTL± 326.31501low-40~12532521.0201XSON6
    74LVC1G98GSProductionn.a.n.a.TTL± 326.31501low-40~12531326.6209XSON6
    74LVC1G98GVProductionn.a.n.a.TTL± 326.31501low-40~12523743.9150TSOP6
    74LVC1G98GWProductionn.a.n.a.TTL± 326.31501low-40~12527750.1165TSSOP6

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74LVC1G98GM
    XSON6
    (SOT886)     		SOT886REFLOW_BG-BD-1
    		SOT886_132ActiveV974LVC1G98GM,132
    ( 9352 931 93132 )
    74LVC1G98GN
    XSON6
    (SOT1115)     		SOT1115REFLOW_BG-BD-1
    		SOT1115_132ActiveV974LVC1G98GN,132
    ( 9352 931 94132 )
    74LVC1G98GS
    XSON6
    (SOT1202)     		SOT1202REFLOW_BG-BD-1
    		SOT1202_132ActiveV974LVC1G98GS,132
    ( 9352 931 95132 )
    74LVC1G98GV
    TSOP6
    (SOT457)     		SOT457REFLOW_BG-BD-1
    WAVE_BG-BD-1
    		SOT457_125ActiveV9874LVC1G98GV,125
    ( 9352 931 96125 )
    74LVC1G98GW
    TSSOP6
    (SOT363-2)     		SOT363-2SOT363-2_125ActiveV974LVC1G98GW,125
    ( 9352 931 97125 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74LVC1G98GM74LVC1G98GM,13274LVC1G98GMAlways Pb-free
    74LVC1G98GN74LVC1G98GN,13274LVC1G98GNAlways Pb-free
    74LVC1G98GS74LVC1G98GS,13274LVC1G98GSAlways Pb-free
    74LVC1G98GV74LVC1G98GV,12574LVC1G98GVAlways Pb-free
    74LVC1G98GW74LVC1G98GW,12574LVC1G98GWAlways Pb-free
    品质及可靠性免责声明

    文档 (19)

    文件名称标题类型日期
    74LVC1G98Low-power configurable multiple function gateData sheet2023-08-22
    AN11009Pin FMEA for LVC familyApplication note2019-01-09
    lvc1g9874LVC1G98 IBIS modelIBIS model2014-10-20
    Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812Single configurable logicLeaflet2019-01-04
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    lvc1g9874LVC1G98 IBIS modelIBIS model2014-10-20

    样品

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